Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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Since 2013
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Recycled ESD Custom JEDEC Trays for BGA Chips - 12×12×1.8mm Cavity Size with High Temperature Resistance up to 150°C

Price Negotiable
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Engineered for precision and protection, our JEDEC trays are fully customizable to fit your unique chip or module dimensions. The structural design complies with JEDEC international standards and perfectly accommodates component carrying requirements while supporting automated feeding systems for modernized loading and improved work efficiency.
Product Overview
We provide comprehensive IC packaging solutions with 100% custom trays suitable for storing and protecting various chip types including BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP packaging methods.
Key Benefits
  • Enables presentation of non-standard components to Pick and Place machines
  • Multiple functional uses including component bake-out, storage, and shipping
  • Cost-effective alternative to "tape and reel" or "hand" placement methods
Applications
IC components, electronic components, semiconductors, micro and nano systems, sensor ICs, and optical devices.
Technical Specifications
Parameter Specification
Model HN1839
Package Type BGA IC
Cavity Size 12×12×1.8mm
Material PPE
Flatness MAX 0.76mm
Resistance 1.0×10⁴-1.0×10¹¹Ω
Color Options Green & Black
Certification ROHS
Product Features
ESD protection, durable construction, high temperature resistance up to 150°C, waterproof properties, recycled materials, and eco-friendly design.
Material Options
MPPO, PPE, ABS, PEI, IDP and other engineering plastics
Customization Services
Available in customized sizes, rectangle and circle shapes with color options including black, red, yellow, green, white and custom colors. We accept OEM and ODM orders with injection mold manufacturing.
Production Details
Service Details
Design Support Original sample creation or custom design development
Packing Carton packaging
Sample Policy Free for stock samples; Custom tray samples negotiated
Lead Time 5-7 working days (varies by order quantity)
JEDEC Tray HN1839-1 showing custom BGA chip carrier with precise cavity dimensions
Frequently Asked Questions
Do your products get any certificates?
Yes, CE certification for the EU market and FDA compliance for the USA market.
Can you do the design for us?
Yes, our professional team has extensive experience in design and manufacturing. Provide your ideas, high-resolution images, logo, and text, and we'll create finished files for confirmation.
How long is the delivery time?
Standard machines: 5-7 working days. Customized/non-standard machines: 20-25 working days.
Do you arrange shipments for the products?
Shipment arrangements depend on Incoterms. We handle shipments for FOB or CIF pricing; clients arrange for EXW pricing.
How about the documents after shipment?
After shipment, we provide all original documents including Commercial Invoice, Packing List, B/L, and required certificates via DHL.
JEDEC Tray HN1839-2 demonstrating high temperature resistance and ESD protection features

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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