ABS Standard Transparent Waffle Pack Lid in black color with anti-static properties, designed for 2-inch and 4-inch electronic component packaging applications.

Our anti-static material effectively dissipates accumulated surface static charges, preventing charge buildup and high potential differences. This significantly reduces electronic product damage rates during production, lowering costs while improving product quality and profitability.

• Compatible with engineered clip system for uniform tray compression
• 2-inch polycarbonate lid with thick pad and laminated interleaf material
• Seals industry standard waffle pack chip tray pockets securely
• Prevents die movement during shipping, handling, and processing

Cover and insert materials utilize industry-standard anti-static Tyvek paper combined with ABS or PC materials. This construction avoids manual placement errors and ensures even sealing of individual pallet pockets while compensating for normal warping conditions.

• Ideal for daily component turnover and long-distance freight
• Supports multi-layer stacking capability
• High-temperature washable for repeated use
• Plastic construction provides waterproof and moisture-proof protection
• Eliminates component extrusion and breakage risks
• Reusable design ensures quality assurance and cost efficiency

• Wafer Dicing Operations
• Wafer Sorting Processes
• Wafer/Die Pick and Place Systems
• Wafer/Die Shipping and Transportation