OEM Black Waffle Pack Chip Trays 101.6×101.6×5.4mm with 324 Cavity Matrix for Automation Equipment
Our black waffle pack chip trays are engineered for semiconductor and photoelectric industries where exceptional cleanliness and dimensional accuracy are critical. From initial design through mold manufacturing, production, cleaning, and packaging, every step undergoes rigorous quality control to ensure complete customer satisfaction.
| Outline Size | 101.6 × 101.6 × 5.4mm | Brand | Hiner-pack |
|---|---|---|---|
| Model | HN21056 | Package Type | N/A |
| Cavity Size | 2.67 × 2.67 × 1.74mm | Matrix Quantity | 18 × 18 = 324 PCS |
| Material | PC (Polycarbonate) | Flatness | MAX 0.3mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0×10⁴-1.0×10¹¹Ω | Certificate | ROHS SGS |
- Semiconductor manufacturing
- Electronic component factories
- SMT surfacing factories
- Optical industry
- Military industry
We are a 100% manufacturer specializing in packaging solutions for over 10 years, with 1500 square meters of workshop area located in Shenzhen, China.
ABS, PC, PPE, MPPO, PEI, HIPS, and other engineering plastics.
Yes, we accept customization and can create packaging solutions according to your specific requirements.
Provide the size of your IC or component thickness, and we will prepare a detailed quotation.
Yes, we can provide samples from stock, though shipping fees are the customer's responsibility.
Yes, we can incorporate your logo. Please provide your logo design for review.
We can ship stock samples immediately. Custom projects depend on specific production timelines.
For more detailed information, please download our comprehensive product catalogue:
Contact our sales department for personalized assistance and technical support.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.