ESD PC Bare Die Trays 50.8x50.8mm with 48 Cavities for Wafer Die Packaging
ESD-safe PC bare die trays designed for secure wafer die packaging using injection molding technology. These waffle pack chip carriers provide superior protection for delicate semiconductor components during handling and transportation.
- ESD protection with surface resistance of 10^4-10^11 Ω
- High precision cavity design with maximum flatness of 0.2mm
- Compatible with automated production systems
- Customizable sizes and materials including ABS, PC, and PPE
- ROHS and SGS certified for quality assurance
- OEM and ODM services available
| Parameter | Value |
|---|---|
| Outline Size | 50.8 × 50.8 × 3.94 mm |
| Cavity Size | 3.98 × 6.11 × 1.08 mm |
| Matrix Quantity | 6 × 8 = 48 cavities |
| Material | PC (Polycarbonate) |
| Surface Resistance | 1.0×10^4 - 1.0×10^11 Ω |
| Flatness | Maximum 0.2mm |
| Color | Black (Customizable) |
| Outline Size | Material Options | Flatness | Customization |
|---|---|---|---|
| 2 inch | ABS, PC, PPE | Max 0.2mm | Available |
| 3 inch | ABS, PC, PPE | Max 0.25mm | Available |
| 4 inch | ABS, PC, PPE | Max 0.3mm | Available |
| Custom sizes | ABS, PC, PPE | TBC | Available |
Ideal for IC packaging, electronic components, semiconductors, micro and nano systems, and sensor IC applications requiring ESD-safe handling.
- Remove carrier clip from waffle pack
- Place lidded waffle pack onto flat ESD surface
- Gently tap cover using tweezers handle
- Lift cover carefully
- Remove die from carrier
Yes, our products are ROHS and SGS certified, with CE compliance for EU markets and FDA standards for USA markets.
Yes, we offer professional OEM and ODM services with experienced engineering teams to realize your specific requirements.
Standard products: 5-7 working days. Customized orders: 20-25 working days.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.