Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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JEDEC Outline MPPO BGA Matrix Tray 322.6×135.9×13.8mm with 50-Cavity ESD Protection

Price Negotiable
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~7 working days
Brand: Hiner-pack
Product Description
JEDEC Outline MPPO Material BGA Matrix Tray
Precision-engineered ESD-safe tray with exact alignment and stackable design for automated IC component handling. Features standard pocket configuration measuring 24.3×18.3×6.1mm with 50-cavity capacity.
Product Overview
Our JEDEC outline BGA matrix trays provide critical electrostatic discharge protection for sensitive electronic components during manufacturing, transportation, and storage processes. The MPPO material construction ensures optimal performance with surface resistance ranging from 1.0×10⁴ to 1.0×10¹¹Ω.
ESD Protection Features
Electrostatic discharge protection is essential for preventing component damage. Our trays provide dual protection: isolating static charge from surrounding objects and dissipating static electricity to prevent rapid discharge that could damage components.
Technical Specifications
Parameter Specification
Brand Hiner-pack
Model HN23072
Outline Dimensions 322.6×135.9×13.8mm
Cavity Size 24.3×18.3×6.1mm
Matrix Quantity 10×5=50 PCS
Material MPPO
Color Black
Surface Resistance 1.0×10⁴-1.0×10¹¹Ω
Flatness MAX 0.76mm
Certificate RoHS
Service Accept OEM, ODM
Material Temperature Resistance
Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0×10⁴Ω~1.0×10¹¹Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0×10⁴Ω~1.0×10¹¹Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0×10⁴Ω~1.0×10¹¹Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0×10⁴Ω~1.0×10¹¹Ω
PEI+Carbon Fiber Max 180°C 1.0×10⁴Ω~1.0×10¹¹Ω
IDP Color 85°C 1.0×10⁶Ω~1.0×10¹⁰Ω
Custom color, temperature, and other special requirements available upon request.
JEDEC tray IC chip tray HN21078-1 showing matrix pocket design and component placement
Frequently Asked Questions
Q1: Are you a manufacturer?
Yes, we are a 100% manufacturer specialized in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.
Q2: What information should we supply if we want a quotation?
Drawing of your IC or component, quantity, and size normally.
Q3: How long could you prepare samples?
Normally, 3 days. If customized, open a new mold 25~30 days around.
Q4: How about batch order production?
Normally, 5-8 days or so.
Q5: Do you inspect the finished products?
Yes, we will do an inspection according to the ISO 9001 standard and be ruled by our QC staff.
JEDEC tray IC chip tray HN21078-2 showing stackable design and dimensional accuracy

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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