Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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HN21090 PES Black JEDEC Tray for IC Chips - 322.6×135.9mm Size, 144 Cavity Capacity, 180°C Heat Resistance

Price Negotiable
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Heat Resistant PES Black JEDEC Trays for IC Chip Packaging
Our HN21090 JEDEC tray series is specifically engineered for QFP, BGA, and other IC packages, providing secure positioning during high-speed manufacturing processes and thermal testing operations.
Product Overview
The HN21090 is a high-temperature resistant IC tray manufactured using PES material and precision injection molding. Designed as a carrier for semiconductor chip companies, this tray maintains structural integrity in bake environments ranging from 120℃ to 220℃ without deformation, earning its reputation as a reliable high-temperature tray in the electronics industry.
Technical Specifications
Parameter Specification
Brand Hiner-pack
Model HN21090
Outline Dimensions 322.6 × 135.9 × 12.5 mm
Cavity Size 9.4 × 10.4 × 4.09 mm
Matrix Quantity 8 × 18 = 144 PCS
Material PES (Polyethersulfone)
Color Black
Surface Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Flatness MAX 0.76 mm
Certifications RoHS Compliant, SGS Certified
Services OEM & ODM Accepted
Key Advantages
  • Lightweight construction reduces transportation and packaging costs
  • Excellent anti-static performance protects products from ESD damage
  • High temperature resistance suitable for 180°C to 200°C automation equipment
  • Superior corrosion resistance for various production conditions
  • Optimized 8×18 matrix design maximizes capacity while ensuring product protection
  • Edge chamfer design prevents stacking errors and ensures proper placement orientation
  • Applications
    Electronic Components, Embedded Systems, Sensor Technology, Test and Measurement Equipment
    HN21090 JEDEC tray for IC chips showing matrix arrangement and black PES construction
    Frequently Asked Questions
    Q1: Are you a manufacturer?
    Yes, we are a 100% manufacturer with over 12 years of packaging expertise, operating from a 1500 square meter workshop in Shenzhen, China.
    Q2: What information should we supply for a quotation?
    Please provide your IC or component drawing, required quantity, and dimensional specifications.
    Q3: How long does sample preparation take?
    Standard samples: 3 days. Customized samples with new molds: approximately 25-30 days.
    Q4: What is the production timeline for batch orders?
    Typically 5-8 working days for production completion.
    Q5: Do you perform quality inspections?
    Yes, all products undergo comprehensive inspection according to ISO 9000 standards by our dedicated QC team.
    Close-up view of HN21090 JEDEC tray showing cavity details and edge chamfer design

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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