Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
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ABS Black 4 Inch Waffle Pack Tray for Micro IC Chips - 101.6×101.6×9mm Size with 140 Cavity Capacity

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview

HN21097 ABS Black 4 Inch Waffle Pack provides permanent anti-static protection for micro IC chips during storage and transportation. This industrial-grade tray features excellent mechanical strength, heat resistance, impact resistance, and chemical corrosion resistance.

Technical Specifications
Outline Line Size 101.6×101.6×9mm Brand Hiner-pack
Model HN21097 Package Type Die
Cavity Size 4.35×5.45×2.5mm Matrix Quantity 10×14=140PCS
Material ABS Flatness MAX 0.3mm
Color Black Service Accept OEM, ODM
Resistance 1.0×10⁴-1.0×10¹¹Ω Certificate ROHS SGS
Key Features
  • Permanent anti-static performance unaffected by environment, time, or temperature
  • Effective static charge dissipation to prevent component damage
  • Reduces short circuit risks during production and transportation
  • Excellent mechanical strength and heat resistance
  • Superior impact strength and chemical corrosion resistance
  • Reusable design with quality assurance
Material Options & Specifications
Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0×10⁴Ω~1.0×10¹¹Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0×10⁴Ω~1.0×10¹¹Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0×10⁴Ω~1.0×10¹¹Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0×10⁴Ω~1.0×10¹¹Ω
PEI+Carbon Fiber Max 180°C 1.0×10⁴Ω~1.0×10¹¹Ω
IDP Color 85°C 1.0×10⁶Ω~1.0×10¹⁰Ω

Color, temperature and other special requirements can be customized

Operational Advantages
  • Suitable for daily turnover or long-distance freight of components
  • Multi-layer stacking capability for space efficiency
  • High-temperature washable for repeated use
  • Waterproof and moisture-proof properties extend component storage life
  • Prevents component extrusion and breakage with superior protection
  • Reusable design ensures long-term quality assurance
ABS Black 4 Inch Waffle Pack Tray for Micro IC Chips
Frequently Asked Questions
Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS, PC, PPE, MPPO, PEI, HIPS, etc.

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products?

Let us know the size of your IC or component thickness, and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?

Yes, we can put your logo in our product, show us your logo firstly please.

Customizable ABS Waffle Pack with Logo Placement Option
Customization Services
  • Sample stock available with professional product selection guidance
  • 24/7 customer support and technical consultation
  • Custom product recommendations based on client requirements
  • Free samples provided after mold customization until customer approval
  • Mass production quality assurance with comprehensive testing

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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