Hangzhou Freqcontrol Electronic Technology Ltd.
                                                                                                           
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27 Years
Since 1999
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12 Inch Semiconductor Silicon Wafer Prime Test Dummy Wafers - 300mm Diameter ±0.2mm with Thermal Oxide Coating

Price Negotiable
Price: Negotiable
MOQ: 25 Pieces
Delivery Time: 1 - 4 weeks
Brand: BonTek
Product Description
Product Overview

12-inch semiconductor silicon wafer prime test dummy wafers serve as essential substrates for microelectronic device manufacturing and testing. These high-purity silicon wafers are fundamental components in semiconductor fabrication processes across the electronics industry.

Technical Specifications
Parameter 2" (50.8mm) 3" (76.2mm) 4" (100mm) 5" (125mm) 6" (150mm) 8" (200mm) 12" (300mm)
Diameter 50.8 ± 0.38mm 76.2 ± 0.63mm 100 ± 0.5mm 125 ± 0.5mm 150 ± 0.2mm 200 ± 0.2mm 300 ± 0.2mm
Thickness 279 ± 25µm 381 ± 25µm 525 ± 20µm or 625 ± 20µm 625 ± 20µm 675 ± 20µm or 625 ± 15µm 725 ± 20µm 775 ± 20µm
Type P, N or Intrinsic
Dopant B, Ph, As or Undoped
Orientation <100>, <111>, <110>
Resistivity 0.001 - 300 ohm/cm
Primary Flat Length 15.88 ± 1.65mm 22.22 ± 3.17mm 32.5 ± 2.5mm 42.5 ± 2.5mm 57.5 ± 2.5mm Notch Notch
Secondary Flat Length 8 ± 1.65mm 11.18 ± 1.52mm 18 ± 2.0mm 27.5 ± 2.5mm 37.5 ± 2.5mm NA NA
Surface Finish SSP, DSP, Etched, or Lapped
Thermal Oxide Coating Options
Thermal Oxide On Both Sides
  • Film thickness: 100Å - 10µm on both sides
  • Film thickness tolerance: Target ±5%
  • Film stress: -320±50 MPa Compressive
Thermal Oxide On Single Side
  • Film thickness: 100Å - 10,000Å on both sides
  • Film thickness tolerance: Target ±5%
  • Film stress: -320±50 MPa Compressive
Product Images
12-inch semiconductor silicon wafer showing surface detail and quality Close-up view of silicon wafer edge and flat specifications Multiple silicon wafers demonstrating consistent diameter and surface finish Silicon wafer packaging and handling demonstration Quality acceptance check procedure for semiconductor wafers
Handling & Acceptance Guidelines
  • Products are fragile and shipped with reinforced packaging and fragile labels via premium domestic and international carriers
  • Upon receipt, inspect outer carton condition before opening. Document packaging alignment with photos before removal
  • Open vacuum packaging exclusively in clean room environments during application
  • If damage is detected during transit, immediately photograph or video document without removing items from packaging. Contact supplier promptly for resolution

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Hangzhou Freqcontrol Electronic Technology Ltd.
Location Room 1106, CIBC, No.198 Wuxing Rd, Hangzhou, P.R.China
Contact Person Xu

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