Fused Silica Wafer

High-precision fused silica and quartz wafers available in thicknesses from 0.05mm to 10mm and diameters from 3" to 12". Features include

High-purity UV grade synthetic fused silica wafers manufactured via CVD method with exceptional transmission (>85% @185nm) and heat resistance. Available in JGS1, Corning 7980, and SK1300 grades with diameters up to 8" (200mm) and surface roughness Ra

High-quality borosilicate glass wafers from 4 to 12 inches diameter, CTE adapted to silicon for optimal anodic bonding. Features include chemical resistance, thermal stability, surface roughness Ra≤1nm, and thickness tolerance ±25μm. Available in single/double side polished options with comprehensive technical specifications and competitive pricing.

Premium borosilicate glass substrate with exceptional optical clarity, thermal shock resistance up to 450°C, and superior surface flatness. Available in 3" to 8" diameters with single/double side polishing options. Ideal for optics, photonics, and analytical equipment applications requiring high temperature stability and low fluorescence.

Custom Fabricated Specialty Glass Wafers with TTV Bow Warp Inspection Report BonTek provide a selection of specialty glass wafers that can be custom fabricated to reach your specific application requirements. Corning ®Gorilla® Glass – this is an aluminum-silicon glass, is more mechanically and chemically resistant than other glass substrates. Borofloat® – has a good mechanical strength, thermal and chemical resistance, has a high degree of transparency. Borosilicate – the

High-precision fused silica and quartz wafers available in 3'' to 13'' diameters with exceptional optical transmission (>85% @185nm) and thermal resistance. Features include Ra ≤1nm surface roughness, SEMI M1.2 compliance, and custom fabrication options. Ideal for demanding industrial and research applications requiring superior flatness and purity.

Glass Wafers As The Si-Diaphragms Mechanical Stabilization And MEMS Etching Structuring Masks Wafers made of glass, are the basis of the modern micro system technology. It is especially used in the semiconductor industries. A common application is the mechanical stabilization of thin Si-diaphragms for sensors, and etching structuring masks for MEMS. The glass wafer substrates are the basic components of LCD panels and OLED substrates, and the wafer quality influences the

BF33 BK7 B270 D263T Glass Substrate 4inch To 12inch With Inspection Reports Fused silica is a noncrystalline (glass) form of silicon dioxide (quartz, sand). It lacks long range order in its atomic structure. Its highly cross-linked three-dimensional structure gives rise to its high use temperature, low thermal expansion coefficient, high purity, high transmission and high refractive index homogeneity. This material is widely used in semiconductor, medical science, communicati

UV, Optical Grade Quartz Wafers For Semiconductor, Photomask, Microwave Filter, Optical Use​ BonTek supply high quality fused silica, fused quartz substrates in UV, optical and semiconductor grade. Quartz wafers have many unique characteristics, such as high operating temperature, high anti-corrosion, good thermal conductivity, high optical transmittance, and low dielectric loss, which make quartz wafers suitable for semiconductor, photomask, microwave filter, optical lens,

Premium double side polished glass wafers available in 2" to 12" diameters with thickness from 100μm to 500μm. Featuring ultra-smooth surfaces with ≤1nm Ra roughness, these wafers are engineered for semiconductor, medical, military, and photonic industries. Custom fabrication and standard inventory available with comprehensive quality control.

Premium 3-inch Soda Lime glass wafers with diameters from 50.8mm to 300mm and thicknesses from 100µm. Features SEMI standard specifications, SSP/DSP surface types, and comprehensive customization options. Rigorous in-house inspection ensures superior quality with LTV < 0.5µm and TTV < 2µm precision standards for industrial applications.

Precision glass carrier wafers designed for MEMS and semiconductor manufacturing. Available in 0.5mm-1mm thicknesses and diameters from 2" to 12". Features thermal stability, chemical resistance, transparency for process monitoring, and reusability for cost efficiency. Customizable specifications with superior TTV and LTV tolerances for industrial applications.

High chemical resistance borosilicate glass wafers in 4'', 6'', and 8'' diameters for MEMS and semiconductor applications. Features thermal expansion matched to silicon for perfect anodic bonding, excellent mechanical strength, and suitability for high temperature processing. Available in single or double side polished with Ra ≤ 1nm surface finish.

High-precision glass wafers for semiconductor applications with TTV as low as 1.5μm and surface roughness Ra≤1nm. Available in multiple glass types including Borofloat 33, fused silica, and industrial formulations. Complete in-house manufacturing with custom fabrication, laser marking, and quality control capabilities. Multiple diameter options from 100mm to 325mm with single or double side polishing options.

High-performance 6-inch Borofloat 33 glass substrate with 0.5mm thickness for semiconductor manufacturing and MEMS. Features exceptional thermal stability, chemical resistance, and mechanical properties. Compliant with SEMI M1.2 standards and available in single/double side polished options for precision applications.

High-performance Borofloat 33 glass wafers with 0.5mm thickness, available in 4-inch and 6-inch diameters. Features exceptional chemical resistance, thermal stability, and SEMI M1.2 compliant edge rounding. Ideal for biotechnology, microelectronics, and photovoltaic industries with customizable specifications and surface finishes.

High-purity semiconductor grade fused silica wafers featuring low coefficient of thermal expansion and minimal OH content for superior UV lithography performance. Available in JGS1, JGS2, and JGS3 specifications with transmission ranges from 0.17-3.50μm and impurity levels as low as 5ppm. Ideal for semiconductor processing, solar applications, and thin film coatings with CMOS compatibility.

High-precision 4-inch diameter fused silica wafers with 0.5mm thickness and double-side polishing. JGS1 grade offers 90% transmission in UV/VIS range, ideal for laser substrates, optical components, and semiconductor applications. Custom fabrication available with expert technical support and secure global shipping.

High-purity amorphous SiO2 fused quartz wafers with superior infrared and ultraviolet spectrum transmission. Available in 3" to 12" diameters with thickness from 0.10mm to 0.50mm. Features double side polishing, SEMI M1.2 compliance, and custom transmittance options for industrial applications.

Precision 150mm and 200mm fused silica and borosilicate wafers with customizable thickness from 0.3mm. Features include ≤1nm surface roughness, SEMI M1.2 compliant edge rounding, and availability in materials from SCHOTT, CORNING, Feilihua, and OHARA. Ideal for semiconductor, optical, and display applications with superior flatness and dimensional accuracy.