Thermal Oxide Silicon Wafer 2" to 300mm N-Type P-Type with 100Å-10µm Insulating Layer
Price:
Negotiable
MOQ:
25 Pieces
Delivery Time:
1 - 4 weeks
Brand:
BonTek
Product Description
High-Quality Thermal Oxide Silicon Wafers
BonTek provides premium silicon thermal oxide wafers in diameters ranging from 2" to 300mm. Our manufacturing process utilizes prime grade, defect-free silicon wafer substrates to ensure the formation of highly uniform thermal oxide layers in controlled furnace environments.
In micro-technology applications, silicon dioxide (SiO₂) serves as the primary insulating material. Thermal oxidation, the most widely adopted technique for creating insulating oxide layers, is performed in specialized furnaces to achieve precise film characteristics.
Thermal Oxide Specifications
Double-Sided Thermal Oxide
- Film thickness: 100Å - 10µm on both sides
- Film thickness tolerance: Target ±5%
- Film stress: -320±50 MPa Compressive
Single-Sided Thermal Oxide
- Film thickness: 100Å - 10,000Å on both sides
- Film thickness tolerance: Target ±5%
- Film stress: -320±50 MPa Compressive
SEMI Standard Specifications
| Parameter | 2" (50.8mm) | 3" (76.2mm) | 4" (100mm) | 5" (125mm) | 6" (150mm) | 8" (200mm) | 12" (300mm) |
|---|---|---|---|---|---|---|---|
| Diameter | 50.8 ± 0.38mm | 76.2 ± 0.63mm | 100 ± 0.5mm | 125 ± 0.5mm | 150 ± 0.2mm | 200 ± 0.2mm | 300 ± 0.2mm |
| Thickness | 279 ± 25µm | 381 ± 25µm | 525 ± 20µm or 625 ± 20µm | 625 ± 20µm | 675 ± 20µm or 625 ± 15µm | 725 ± 20µm | 775 ± 20µm |
| Type | P, N or Intrinsic | ||||||
| Dopant | B, Ph, As or Undoped | ||||||
| Orientation | <100>, <111>, <110> | ||||||
| Resistivity | 0.001 - 300 ohm/cm | ||||||
| Primary Flat Length | 15.88 ± 1.65mm | 22.22 ± 3.17mm | 32.5 ± 2.5mm | 42.5 ± 2.5mm | 57.5 ± 2.5mm | Notch | Notch |
| Secondary Flat Length | 8 ± 1.65mm | 11.18 ± 1.52mm | 18 ± 2.0mm | 27.5 ± 2.5mm | 37.5 ± 2.5mm | NA | NA |
| Surface Finish | SSP, DSP, Etched, or Lapped | ||||||
Acceptance Check & Handling Instructions
- Products are fragile and adequately packed with fragile labeling. We utilize premium domestic and international express services to ensure transportation quality.
- Upon receipt, handle with care and inspect outer carton condition. Carefully open outer carton and verify packing box alignment. Document with photographs before removal.
- Open vacuum packaging exclusively in clean room environments when products are ready for application.
- If damage is detected during transit, immediately photograph or video document the condition. DO NOT remove damaged products from packaging boxes. Contact us immediately for resolution.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Hangzhou Freqcontrol Electronic Technology Ltd.
Location
Room 1106, CIBC, No.198 Wuxing Rd, Hangzhou, P.R.China
Contact Person
Xu