Hangzhou Freqcontrol Electronic Technology Ltd.
                                                                                                           
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Boron and Phosphorus Doped Silicon Wafers 2-12 Inch Diameter with 0.001-300 Ohm/cm Resistivity for Semiconductor Manufacturing

Price Negotiable
Price: Negotiable
MOQ: 25 Pieces
Delivery Time: 1 - 4 weeks
Brand: BonTek
Product Description
Boron and phosphorus doped silicon wafers are specialized semiconductor substrates engineered with precise electrical properties. These wafers serve as the foundation for manufacturing advanced electronic components and integrated circuits.
Semiconductor Wafer Technology
Silicon wafers are thin slices of pure crystallized silicon. Undoped or intrinsic silicon wafers provide the base material, while the addition of dopants like boron or phosphorus enables precise control over electrical characteristics. Boron doping creates P-type wafers with positive charge carriers, while phosphorus doping produces N-type wafers with negative charge carriers.
Boron doped silicon wafer with high resistivity for semiconductor applications
Phosphorus doped silicon wafer surface detail and structure
High resistivity silicon wafer manufacturing quality and precision
Technical Specifications
SEMI Standard 2" (50.8mm) 3" (76.2mm) 4" (100mm) 5" (125mm) 6" (150mm) 8" (200mm) 12" (300mm)
Diameter 50.8 ± 0.38mm 76.2 ± 0.63mm 100 ± 0.5mm 125 ± 0.5mm 150 ± 0.2mm 200 ± 0.2mm 300 ± 0.2mm
Thickness 279 ± 25µm 381 ± 25µm 525 ± 20µm or 625 ± 20µm 625 ± 20µm 675 ± 20µm or 625 ± 15µm 725 ± 20µm 775 ± 20µm
Type P, N or Intrinsic
Dopant B, Ph, As or Undoped
Orientation <100>, <111>, <110>
Resistivity 0.001 - 300 ohm/cm
Primary Flat Length 15.88 ± 1.65mm 22.22 ± 3.17mm 32.5 ± 2.5mm 42.5 ± 2.5mm 57.5 ± 2.5mm Notch Notch
Secondary Flat Length 8 ± 1.65mm 11.18 ± 1.52mm 18 ± 2.0mm 27.5 ± 2.5mm 37.5 ± 2.5mm NA NA
Surface Finish SSP, DSP, Etched, or Lapped
Silicon wafer quality control and inspection process
Acceptance Check & Handling Instructions
Silicon wafer acceptance check and quality verification
  • Products are carefully packaged with fragile labeling and shipped via reliable domestic and international carriers
  • Upon receipt, inspect outer carton condition and packaging alignment before removing contents
  • Open vacuum packaging exclusively in clean room environments during application
  • Document any transit damage immediately with photos/video while keeping products in original packaging
  • Contact supplier immediately for any damage claims or quality concerns

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Hangzhou Freqcontrol Electronic Technology Ltd.
Location Room 1106, CIBC, No.198 Wuxing Rd, Hangzhou, P.R.China
Contact Person Xu

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