Shenzhen Fuchangwei Technology Co., Ltd
                                                                                                           
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Chip Integrated Circuit Inductor 10uH , High Current smd power inductor

Price Negotiable
Price: Negotiate
MOQ: 2000 pcs
Delivery Time: 3-21days
Brand: Forewell
Product Description

Molding Power Choke SMD Inductors Chip Integrated Circuit Inductor High Current alloy powder

SMD Power Inductor Original Smd Alloy Powder Molded Chip Integrated Circuit Ic 1.0uH~4.7uH

Molding Power Choke SMD Inductors Chip Integrated Circuit Inductor High Current Alloy Powder

 

Features:

  • Magnetically shielded construction, low DC resistance;
  • The use of magnetic iron powder ensure capability for large current;
  • Low audible core noise;
  • Ideal for DC-DC converter applications in hand held personal computer and etc;
  • Handles high transient current spikes without saturation
  • Ultra low buzz noise, due to composite construction
  • Ultra-thin size, can be applied to MINI products
  • Small tolerance, no heat generation, convenient production

Applications:

  • Smart phone,MID;
  • Next-generation mobile devices with multifunction such as adding color TV and digital movie cameras;
  • Flat-screen TVs, blue-ray disc recorders, set top box;
  • Notebooks, desktop computers, servers, graphic cards;
  • Portable gaming devices, personal navigation systems, personal multimedia devices;
  • Automotive systems;
  • Bluetooth Products

Specification:

 

tem Description
Category Molding Power Inductor
Inductance 0.10uH~10uH 
Current Rating (Amps) 40A~6.0A
Size / Dimension 7.1*6.6*2.4mm
Material alloy powder

 

Dimensions

Specification

 

Packaging Information:

 

NOTES:

  • DC current (Idc) that will cause an approximate △T of 40℃
  • DC current (Isat) that will cause Lo to drop approximately 20%
  • All test data is referenced to 25℃ ambient
  • Operating Temperature Range -55℃ to +120℃
  • The part temperature (ambient + temp rise) should not exceed 120℃ under the worst operating conditions. 
  • Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions                                         
  • all affect the part temperature. Part temperature should be verified in the end application.

Packaging Quantity(pcs)

 

 

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Fuchangwei Technology Co., Ltd
Location 5th Floor, Building D4, Huitong Industrial Park, Hongye Middle Road, Yongtou Community, Chang'an Town, Dongguan,Guandong,China.
Contact Person Connie Zheng

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