Notebook Thermal Pad
Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.k thermal conductivity
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler, Silicone, and Reinforced Fiberglass | - |
| Color | White and Brick Red | Visual |
| Thickness(mm) | 0.5~12.0 | ASTM D374 |
| Density(g/cc) | 2.5 | ASTM D792 |
| Hardness(shore oo) | 30±5 | ASTM D2240 |
| Tensile Strength(KN/m) | 2.5 | ASTM D624 |
| Elongation(%) | 60 | ASTM D412 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥7.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 5.7 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1013 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 1.0±0.1 | ASTM D5470 |
Product feature:
■ Thermal Conductivity:1.0 W/m.K
■ Ultra soft and highly compliant
■ Naturally tacky on one side
■ thermal silicone sheet with shock absorption and sound absorption effect;
■ High breakdown voltage
■ The main purpose of the thermal conductive silica gel piece is to reduce the thermal resistance generated between the heat source surface and the contact surface of the heat dissipation device. The thermal conductive silica gel piece can fill the gap of the contact surface well.
■ Elongation 60%
Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs
Purchase information:
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
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