Multiscene Silicone Free Thermal Pad 2 W/m.K Ultrasoft High Performance
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Acrylate | - |
| Color | Blue | Visual |
| Thickness(mm) | 0.5-10.0 | ASTM D374 |
| Density(g/cc) | 2.9 | ASTM D792 |
| Hardness(shore oo) | 45±5 | ASTM D2240 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥6.0 | ASTM D149 |
| Flammability | V-1 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 2.0 | ASTM D5470 |
Application of silicon free thermal pad:
Hard disk
Optical precision equipment
Notebook computer, projector and OA office electronic products
Mobile and communication equipment, high-speed mass
Storage drives, heat pipe assemblies, automotive engine control equipment
Telecommunication hardware and equipment, high-end industrial control and medical electronics
Product feature
■ Thermal conductivity: 2.0,3.0 W/m.K
■ Naturally tacky, easing application
■ Silicone free
■ Excellent, high volume applications
■ Excellent electrical isolation
■ Excellent compression vs. deflection performance.
■ No siloxane volatilization
■ High thermal conductivity
■ High insulation
■ High compressibility
Typical applications
■ Fiber Optics
■ Medical Device
■ Hard Disc Driver
■ Automotive Sensors and Modules
■ Silicon Sensitive Components
■ Hard disk
■ Optical precision equipment
■ Notebook computer, projector and OA office electronic products
■ Mobile and communication equipment, high-speed mass
■ Storage drives, heat pipe assemblies, automotive engine control equipment
■ Telecommunication hardware and equipment, high-end industrial control and medical electronics
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