YJJ XGZP701DB1R Pressure Sensor DIP Package MEMS Pneumatic Hydraulic Pressure 700KPa1 Negative Pressure Vacuum

Product Description:

YJJ XGZP701DB1R Pressure Sensor DIP Package MEMS Pneumatic Hydraulic Pressure 700KPa1 Negative Pressure Vacuum

Features:

XGZP series is a pressure sensor suitable for biomedical, meteorological and other fields, the core of which is a pressure sensor chip processed by MEMS technology.The pressure sensor chip consists of an elastic film and four resistors integrated on the film.The four varistors form the whitstone bridge structure, which generates a voltage output signal proportional to the applied pressure when applied to the elastic film.

Product features:

Measuring range -100kPa ~ 20kPa...700 kpa

MEMS technology

Gage pressure form

SOP or DIP package

Suitable for non corrosive gases or liquids

Operating temperature range :-40℃ ~ +125℃

Chip back cavity is pressurized

Pin orientation is optional

Application:

Electronic blood pressure meter, oxygen generator, alcohol tester, monitor and other medical fields

Tire pressure gauge, MAP sensor and other automotive electronics

Massager, massage chair, air cushion bed and other sports fitness equipment field

Washing machines, beer machines, coffee machines, emergency lights, vacuum cleaners, pneumatic components and other fields

Structural performance:

Pressure sensitive chip: silicon

N wire: gold wire

N package housing: PPS material

N pin: copper plated silver

N net weight: about 1 g

Electrical performance:

N power supply: ≤10V DC or ≤ 2.0ma DC

N input impedance: 4 k Ω Ω ~ 6 k

N output impedance: 4 k Ω Ω ~ 6 k

N insulation resistance: 100 m Ω, 100 VDC

N allowed overload:

0 ~ 20 kpa...200kPa:2 times full range

0 ~ 500 kpa...700kPa:1.5 full range

Basic conditions:

N measuring medium: air

N medium temperature :(25±1) ℃

N ambient temperature :(25±1) ℃

N vibration: 0.1g(1m/s2)Max

Humidity :(50%±10%) RH

N source :(5±

Specifications: