SUZHOU HSF ELECTRONIC MATERIALS TECHNOLOGY CO., LTD.
                                                                                                           
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6.5 μm Copper Electroplating PP Film used as Cathode in Battery PCB Circuitas an alternative to Pure copper foil

Price Negotiable
MOQ: 4000 square meter
Delivery Time: within 10 days at MOQ basis
Brand: HSF
Product Description

Copper Electroplating PP Film, 6.5 Micron, Ideal Substitute For Pure Copper Foil Film, Excellent Cost Effectiveness

 

 

Copper Electroplating Polymer Film Structure and Product Advantages          

Safety Improving The base film made of polymer largely reduces the risk of out-of-control events such as short circuit due to punctures, overheating, etc.,and greatly improves the combustion safety factor.
Energy Density Increasing The middle layer of the composite current collector is made of lightweight polymer material that is 50-80% lighter than a pure metal current collector, increasing the battery's energy density by 5-10%.
Extended Service Life The elastic modulus of the polymer material is lower than that of metal, and a layered annular sponge structure is formed around the active material layer of the battery. The active material layer of the pole-piece expands due to the intercalation and desorption of lithium ions during the expansion and contraction of the active material layer of the pole-piece, and shrinks. During the charging and discharging process of the battery, the electrode interface absorbs stress to maintain long-term integrity, and the battery cycle life is increased by 5%.
Compatibility The current collector is not an integral part of the lithium ion transport inside the battery, and direct upgrading of a conventional current collector to a compound current collector does not affect the electrochemical reaction inside the battery.

                                                          

In terms of mechanical performance, we have not done the contrast tests with the conventional pure copper foil, but according to feedback
from Chinese end users such as CATL, SVOLT Energy, etc., the performance is almost the same.
 
At present, it only involves application scenarios in the battery field, but it’s believed that the Copper Electroplating Films can replace almost all
application scenarios that traditional pure copper foil used to work in the near future.
 

This product is an ideal substitute for pure copper foil film that will bring an excellent cost effectiveness.

Please feel free to reach us to get more information about this product.

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Company SUZHOU HSF ELECTRONIC MATERIALS TECHNOLOGY CO., LTD.
Location 2F, No. 156, East Jinling Road, Weiting, Suzhou Industrial Park, 2 East (East side), 215127 Suzhou city, Jiangsu Province, China.
Contact Person Jucy yang

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