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TLV2374IDR Audio Power Amplifier IC Op Amps Quad 3MHz R/R

Price Negotiable
Price: Contact us
MOQ: Contact us
Delivery Time: The goods will be shipped within 3 days once received fund
Brand: Ti
Product Description

TLV2374IDR Audio Power Amplifier IC Op Amps Quad 3MHz R/R

 

1 Features

  • Rail-to-Rail Input and Output
  • Wide Bandwidth: 3 MHz

  • High Slew Rate: 2.4 V/μs

  • Supply Voltage Range: 2.7 V to 16 V

  • Supply Current: 550 μA/Channel

  • Low-Power Shutdown Mode

– IDD(SHDN): 25 μA/Channel

  • Input Noise Voltage: 39 nV/√Hz

  • Input Bias Current: 1 pA

  • Specified Temperature Range:

– −40°C to +125°C (Industrial Grade) • Ultra-Small Packaging:

  • – 5- or 6-Pin SOT-23 (TLV2370, TLV2371)

  • – 8- or 10-Pin MSOP (TLV2372, TLV2373)

     

2 Applications

  • White Goods

  • Handheld Test Equipment

  • Portable Blood Glucose Systems

  • Remote Sensing

  • Active Filters

  • Industrial Automation

  • Battery-Powered Electronics

     

3 Description

The TLV237x single-supply operational amplifiers provide rail-to-rail input and output capability. The TLV237x takes the minimum operating supply voltage down to 2.7 V over the extended industrial temperature range while adding the rail-to-rail output swing feature. The TLV237x also provides 3-MHz bandwidth from only 550 μA. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from (±8-V supplies down to ±1.35 V) a variety of rechargeable cells.

The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making an ideal alternative for the TLC227x in battery-powered applications. The rail-to-rail input stage further increases its versatility. The TLV237x is the seventh member of a rapidly growing number of RRIO products available from TI, and it is the first to allow operation up to 16-V rails with good ac performance.

All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP, and quads in the TSSOP package.

The 2.7-V operation makes the TLV237x compatible with Li-Ion powered systems and the operating supply voltage range of many micro-power microcontrollers available today including TI’s MSP430.

Device Information

PART NUMBER

PACKAGE

BODY SIZE (NOM)

TLV237x

PDIP (8)

9.81 mm × 6.35 mm

PDIP (14)

19.30 mm × 6.35 mm

SOIC (8)

4.90 mm × 3.91 mm

SOIC (14)

8.65 mm × 3.91 mm

TSSOP (14)

5.00 mm × 4.40 mm

TSSOP (16)

SOT-23 (6)

2.90 mm × 1.60 mm

SOT-23 (5)

VSSOP (8)

3.00 mm × 3.00 mm

VSSOP (10)

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Company ChongMing Group (HK) Int'l Co., Ltd
Location Room 1204, DingCheng International Building, 518028 Futian District, SHENZHEN, CN
Contact Person Doris Guo

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