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LMH6624MAX/NOPB Audio Power Amplifier IC Precision Amplifiers LMH6624 Mil-Aero Datasheet MNLMH6624-X

Price Negotiable
Price: Contact us
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Delivery Time: The goods will be shipped within 3 days once received fund
Brand: TI
Product Description

LMH6624MAX/NOPB LMH6626 Audio Power Amplifier IC Precision Amplifiers LMH6624 Mil-Aero Datasheet MNLMH6624-X

 

1 Features

  • VS = ±6 V, TA = 25°C, AV = 20 (Typical Values Unless Specified)
  • Gain Bandwidth (LMH6624) 1.5 GHz

  • Input Voltage Noise 0.92 nV/√Hz

  • Input Offset Voltage (limit over temp) 700 μV

  • Slew Rate 350 V/μs

  • Slew Rate (AV = 10) 400 V/μs

  • HD2atf=10MHz,RL =100Ω−63dBc

  • HD3atf=10MHz,RL =100Ω−80dBc

  • Supply Voltage Range (Dual Supply) 2.5 V to 6 V

  • Supply Voltage Range (Single Supply) 5 V to 12 V

  • Improved Replacement for the CLC425 (LMH6624)

  • Stable for Closed Loop |AV| ≥ 10

     

2 Applications

  • Instrumentation Sense Amplifiers

  • Ultrasound Pre-amps

  • Magnetic Tape & Disk Pre-amps

  • Wide Band Active Filters

  • Professional Audio Systems

  • Opto-electronics

  • Medical Diagnostic Systems

 

3 Description

The LMH6624 and LMH6626 devices offer wide bandwidth (1.5 GHz for single, 1.3 GHz for dual) with very low input noise (0.92 nV/√Hz, 2.3 pA/√Hz) and ultra-low dc errors (100 μV VOS, ±0.1 μV/°C drift) providing very precise operational amplifiers with wide dynamic range. This enables the user to achieve closed-loop gains of greater than 10, in both inverting and non-inverting configurations.

The LMH6624 (single) and LMH6626 (dual) traditional voltage feedback topology provide the following benefits: balanced inputs, low offset voltage and offset current, very low offset drift, 81dB open loop gain, 95dB common mode rejection ratio, and 88dB power supply rejection ratio.

The LMH6624 and LMH6626 devices operate from ±2.5 V to ±6 V in dual supply mode and from 5 V to 12 V in single supply configuration.

LMH6624 is offered in SOT-23-5 and SOIC-8 packages. The LMH6626 is offered in SOIC-8 and VSSOP-8 packages.

Device Information

PART NUMBER

PACKAGE

BODY SIZE (NOM)

LMH6624

SOT-23 (5)

2.90 mm × 1.60 mm

SOIC (8)

4.90 mm × 3.91 mm

LMH6626

SOIC (8)

4.90 mm × 3.91 mm

VSSOP (8)

3.00 mm × 3.00 mm 

 

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ChongMing Group (HK) Int'l Co., Ltd
Location Room 1204, DingCheng International Building, 518028 Futian District, SHENZHEN, CN
Contact Person Doris Guo

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