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LMV611MF/NOPB Audio Power Amplifier IC Op Amps Lo Vltg,Low Pwr,RRIO Gen Purp amp

Price Negotiable
Price: Contact us
MOQ: Contact us
Delivery Time: The goods will be shipped within 3 days once received fund
Brand: TI
Product Description

LMV611MF/NOPB Audio Power Amplifier IC Op Amps Lo Vltg,Low Pwr,RRIO Gen Purp amp

 

1 Features

  • Supply Values: 1.8 V (Typical)
  • Ensured 1.8-V, 2.7-V, and 5-V Specifications

  • Output Swing:

    • – 80 mV From Rail With 600-Ω Load

    • – 30 mV From Rail With 2-kΩ Load

  • VCM = 200 mV Beyond Rails

  • 100-μA Supply Current (Per Channel)

  • 1.4-MHz Gain Bandwidth Product

  • Maximum VOS = 4 mV

  • Temperature Range: −40°C to +125°C

  • Create a Custom Design Using the LMV61x With the WEBENCH® Power Designer

     

2 Applications

  • Consumer Communication

  • Consumer Computing

  • PDAs

  • Audio Pre-Amplifiers

  • Portable or Battery-Powered Electronic Equipment

  • Supply Current Monitoring

  • Battery Monitoring

 

3 Description

The LMV61x devices are single, dual, and quad low- voltage, low-power operational amplifiers (op amps). They are designed specifically for low-voltage, general-purpose applications. Other important product characteristics are, rail-to-rail input or output, low supply voltage of 1.8 V and wide temperature range. The LMV61x input common mode extends 200 mV beyond the supplies and the output can swing rail-to-rail unloaded and within 30 mV with 2-kΩ load at 1.8-V supply. The LMV61x achieves a gain bandwidth of 1.4 MHz while drawing 100-μA (typical) quiescent current.

The industrial-plus temperature range of −40°C to 125°C allows the LMV61x to accommodate a broad range of extended environment applications.

The LMV611 is offered in the tiny 5-pin SC70 package, the LMV612 in space-saving 8-pin VSSOP and SOIC packages, and the LMV614 in 14-pin TSSOP and SOIC packages. These small package amplifiers offer an ideal solution for applications requiring minimum PCB footprint. Applications with area constrained PCB requirements include portable and battery-operated electronics.

Device Information

PART NUMBER

PACKAGE

BODY SIZE (NOM)

LMV611

SOT-23 (5)

2.92 mm × 1.60 mm

SC70 (5)

2.00 mm × 1.25 mm

LMV612

VSSOP (8)

3.00 mm × 3.00 mm

SOIC (8)

4.90 mm × 3.91 mm

LMV614

TSSOP (14)

5.00 mm × 4.40 mm

SOIC (14)

8.64 mm × 3.90 mm

 

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ChongMing Group (HK) Int'l Co., Ltd
Location Room 1204, DingCheng International Building, 518028 Futian District, SHENZHEN, CN
Contact Person Doris Guo

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