LMZ31707RVQR LMZ31707RVQT LMZ31710RVQR LMZ31710RVQT Mosfet Power Transistor Non-Isolated DC/DC Converters 7A

LMZ31707RVQR LMZ31707RVQT LMZ31710RVQR LMZ31710RVQT Mosfet Power Transistor Non-Isolated DC/DC Converters 7A

1 Features

• Complete integrated power solution allows small footprint, low-profile design

• 10mm×10mm×4.3mmpackage
– Pin compatible with LMZ31710 and LMZ31704

• Efficiencies Up To 95%

• Eco-modeTM / light load efficiency (LLE)

• Wide-output voltage adjust
  0.6 V to 5.5 V, with 1% reference accuracy

• Supports parallel operation for higher current

• Optional split power rail allows input voltage down to 2.95 V

• Adjustable switching frequency (200 kHz to 1.2 MHz)

• Synchronizes to an external clock

• Provides 180° out-of-phase clock signal

• Adjustable slow start

• Output voltage sequencing / tracking

• Power good output

• Programmable undervoltage lockout (UVLO)

• Overcurrent and overtemperature protection

• Pre-Bias output start-up

• Operating temperature range: –40°C to +85°C

• Enhanced thermal performance: 13.3°C/W

• Meets EN55022 Class B emissions

– Integrated shielded inductor
 

2 Applications

• Broadband and communications infrastructure

• Automated test and medical equipment

• Compact PCI / PCI express / PXI express

• DSP and FPGA point-of-load applications

3 Description

The LMZ31707 SIMPLE SWITCHER® power module is an easy-to-use integrated power solution that combines a 7-A DC-DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.

The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. Achieves greater than 95% efficiency and excellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31707 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.