Automated Through-Hole Assembly Process Drop Alt Pcba Main Board
SMT basic process elements include:
screen printing (or dispensing), mounting (curing), reflow soldering, cleaning, testing, repair
1. Screen printing: Its function is to leak solder paste or patch glue onto the PCB pad to prepare for the welding of components. The equipment used is screen printing machine (screen printing machine), located at the front end of the SMT line.
2, dispensing: it is to drop the glue to the fixed position of the PCB board, its main role is to fix the components to the PCB board. The equipment used is the dispensing machine, which is located at the front end of the SMT production line or behind the testing equipment.
| Turnkey PCBA | PCB+components sourcing+assembly+package | ||||
| Assembly details | SMT and Thru-hole, ISO lines | ||||
| Lead Time | Prototype: 15 work days. Mass order: 20~25 work days | ||||
| Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, functional test | ||||
| Quantity | Min quantity: 1pcs. Prototype, small order, mass order, all OK | ||||
| Files we need | PCB: Gerber files(CAM, PCB, PCBDOC) | ||||
| Files we need | Components: Bill of Materials(BOM list) | ||||
| Files we need | Assembly: Pick-N-Place file | ||||
| PCB panel Size | Min size: 0.25*0.25 inches(6*6mm) | ||||
| Max size: 20*20 inches(500*500mm) | |||||
| PCB Solder Type | Water Soluble Solder Paste, RoHS lead free | ||||
| Components details | Passive Down to 0201 size | ||||
| Components details | BGA and VFBGA | ||||
| Components details | Leadless Chip Carriers/CSP | ||||
| Components details | Double-sided SMT Assembly | ||||
| Components details | Fine Pitch to 0.8mils | ||||
| Components details | BGA Repair and Reball | ||||
| Components details | Part Removal and Replacement | ||||
| Component package | Cut Tape,Tube,Reels,Loose Parts | ||||
| PCB assembly | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing | ||||
PCB assembly manufacturing service:
1. Turnkey contract PCBA( PCB assembly ) manufacturing
2. Strong ability in material sourcing and quality management
3. Quality authentication: Rosh(lead-free, Pb-free), ISO9001: 2008, UL
4. SMT, DIP and wave solder processing
5. Reliable OEM/ODM PCBA( PCB assembly ) service
6. Flexible & rigid PCB assembly manufacturing, PCB layout design
7. 4 layers. 6 layers ,multilayers PCBA( PCB assembly )
8. In-circuit testing, functional testing and flying probe testing
9. SMT placement for SOP, QFP, CSP, and BGA packages
10. Full experienced QC and inspector
11. PCBA( PCB assembly ) for power, communication equipment, remote control system and consumer electronic products and so on
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