Plated Through Hole Pcb Board Pcba Printed Circuit Board Assembly Manufacturing Process

SMT

SMT patch processing will purchase components according to BOM, BOM provided by customers and confirm the PMC plan of production. After the preparatory work is completed, we will start SMT programming, manufacture laser steel mesh and solder paste printing according to the SMT process.

The components will be mounted on the circuit board through SMT mounter, and online AOI automatic optical detection will be carried out if necessary. After testing, the perfect reflow furnace temperature curve is set to let the circuit board flow through reflow welding.

After the necessary IPQC inspection, the DIP material can then be passed through the circuit board using the DIP process and then through wave soldering. Then it is time to carry out the necessary post-furnace process.

After all the above processes are completed, QA will conduct a comprehensive test to ensure product quality.

DIP

1,The process of DIP processing is: putting in the hole →AOI→ wave soldering → cutting pin →AOI→ correction → washing → quality inspection.

2,After wave soldering, The products will be will scanned by AOI equipment to ensure that no error occurs.