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CY7C1355C-133AXC IC SRAM 9MBIT PARALLEL 100TQFP Infineon Technologies

Price Negotiable
Price: Based on current price
MOQ: 1
Delivery Time: 3-5 work days
Brand: Infineon Technologies
Product Description

Product Details

 

Functional Description[1]

The CY7C1355C/CY7C1357C is a 3.3V, 256K x 36/512K x 18 Synchronous Flow-through Burst SRAM designed specifically to support unlimited true back-to-back Read/Write operations without the insertion of wait states. The CY7C1355C/CY7C1357C is equipped with the advanced No Bus Latency (NoBL) logic required to enable consecutive Read/Write operations with data being transferred on every clock cycle. This feature dramatically improves the throughput of data through the SRAM, especially in systems that require frequent Write-Read transitions.

 

 

Features

• No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles
• Can support up to 133-MHz bus operations with zero wait states
— Data is transferred on every clock
• Pin compatible and functionally equivalent to ZBT™ devices
• Internally self-timed output buffer control to eliminate the need to use OE
• Registered inputs for flow-through operation
• Byte Write capability
• 3.3V/2.5V I/O power supply (VDDQ)
• Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
• Clock Enable (CEN) pin to enable clock and suspend operation
• Synchronous self-timed writes
• Asynchronous Output Enable
• Available in JEDEC-standard and lead-free 100-Pin TQFP, lead-free and non lead-free 119-Ball BGA package and 165-Ball FBGA package
• Three chip enables for simple depth expansion.
• Automatic Power-down feature available using ZZ mode or CE deselect
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• Burst Capability—linear or interleaved burst order
• Low standby power

 

Specifications

Attribute Attribute Value
Manufacturer Cypress Semiconductor
Product Category Memory ICs
Series NoBL™
Type Synchronous
Packaging Tray Alternate Packaging
Unit-Weight 0.023175 oz
Mounting-Style SMD/SMT
Package-Case 100-LQFP
Operating-Temperature 0°C ~ 70°C (TA)
Interface Parallel
Voltage-Supply 3.135 V ~ 3.6 V
Supplier-Device-Package 100-TQFP (14x20)
Memory Capacity 9M (256K x 36)
Memory-Type SRAM - Synchronous
Speed 133MHz
Data-Rate SDR
Access-Time 6.5 ns
Format-Memory RAM
Maximum Operating Temperature + 70 C
Operating temperature range 0 C
Interface-Type Parallel
Organization 256 k x 36
Supply-Current-Max 250 mA
Supply-Voltage-Max 3.6 V
Supply-Voltage-Min 3.135 V
Package-Case TQFP-100
Maximum-Clock-Frequency 133 MHz

Functional compatible component

Form,Package,Functional compatible component

 

Manufacturer Part# Description Manufacturer Compare
CY7C1355B-100AC
Memory
ZBT SRAM, 256KX36, 7.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cypress Semiconductor CY7C1355C-133AXC vs CY7C1355B-100AC
CY7C1355C-100AXC
Memory
ZBT SRAM, 256KX36, 7.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 Cypress Semiconductor CY7C1355C-133AXC vs CY7C1355C-100AXC
CY7C1355C-133AXI
Memory
ZBT SRAM, 256KX36, 6.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 Cypress Semiconductor CY7C1355C-133AXC vs CY7C1355C-133AXI
CY7C1355A-100AC
Memory
ZBT SRAM, 256KX36, 7.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cypress Semiconductor CY7C1355C-133AXC vs CY7C1355A-100AC
GVT71256ZB36-7.5I
Memory
ZBT SRAM, 256KX36, 7.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cypress Semiconductor CY7C1355C-133AXC vs GVT71256ZB36-7.5I

Descriptions

SRAM - Synchronous Memory IC 9Mb (256K x 36) Parallel 133MHz 6.5ns 100-TQFP (14x20)
SRAM Chip Sync Quad 3.3V 9M-Bit 256K x 36 6.5ns 100-Pin TQFP Tray
SRAM 9Mb 133Mhz 256K x 36 Flow-Thru SRAM

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Company Sanhuang electronics (Hong Kong) Co., Limited
Location No. 2520, 25th Floor, Block A, New Asia Guoli Building, Huaqiang North Street, Shenzhen, China
Contact Person Zhao

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