S25FS128SAGMFI103 NOR Flash 128Mb, 1.8V, 133Mhz MirrorBit SPI Flash

Features

• Density

- S25FS128S - 128 Mbits (16 MB)

- S25FS256S - 256 Mbits (32 MB)

• Serial peripheral interface (SPI)

- SPI clock polarity and phase modes 0 and 3

- Double data rate (DDR) option

- Extended addressing: 24- or 32-bit address options

- Serial command subset and footprint compatible with S25FL-A, S25FL-K, S25FL-P, and S25FL-S SPI families

- Multi I/O command subset and footprint compatible with S25FL-P, and S25FL-S SPI families

• Read - Commands: Normal, Fast, Dual I/O, Quad I/O, DDR Quad I/O

- Modes: Burst Wrap, Continuous (XIP), QPI

- Serial flash discoverable parameters (SFDP) and common flash interface (CFI), for configuration information

• Program

- 256- or 512-byte page programming buffer

- Program suspend and resume

- Automatic ECC – internal hardware error correction code generation with single-bit error correction

• Erase

- Hybrid sector options

• Physical set of eight 4-KB sectors and one 32-KB sector at the top or bottom of address space with all

  remaining sectors of 64 KB or

• Physical set of eight 4-KB sectors and one 224-KB sector at the top or bottom of address space with

  all remaining sectors of 256 KB - Uniform sector options

• Uniform 64-KB or 256-KB blocks for software compatibility with higher density and future devices

- Erase suspend and resume

- Erase status evaluation

- 100,000 program-erase cycles, minimum

- 20 year data retention, minimum

• Security features

- One-time program (OTP) array of 1024 bytes

- Block protection:

• Status Register bits to control protection against program or erase of a contiguous range of sectors

• Hardware and software control options- Advanced sector protection (ASP)

• Individual sector protection controlled by boot code or password

• Option for password control of read access

• Technology

- 65-nm MIRRORBIT™ technology with Eclipse architecture

• Supply voltage- 1.7 V to 2.0 V

Features

• Temperature range / grade

- Industrial (–40°C to +85°C)

- Industrial Plus (–40°C to +105°C)

- Automotive AEC-Q100 grade 3 (–40°C to +85°C)

- Automotive AEC-Q100 grade 2 (–40°C to +105°C)

- Automotive AEC-Q100 grade 1 (–40°C to +125°C)

• Packages (All Pb-free)

- 8-lead SOIC 208 mil (SOC008) — FS128S only

- WSON 6× 5 mm (WND008) — FS128S only

- WSON 6 × 8 mm (WNH008)

- 16-lead SOIC 300 mil (SO3016 — FS256S only)

- BGA-24 6 × 8 mm

• 5 × 5 ball (FAB024) footprint

• 4 × 6 ball (FAC024) footprint

- Known good die, and known tested die