MSOP-8 Package ESD Array SE02P8M14HA ESD Surge Protection Low Clamping Voltage
MSOP-8 Package ESD Arrays SE02P8M14HA Ultra-Low Capacitance 1.5pF @ 3.0V (Typical) ESD Surge Protection
ESD Arrays DATASHEET: SE02P8M14HA_v2207.1.pdf
ESD Arrays Features:
- Package optimized for high-speed lines
- Low capacitance: 1.5pF @ 3.0V (Typical)
- Low leakage current: 0.1uA @ VRWM (Typical)
-
Low operating and clamping voltage
ESD Arrays Applications:
- 10/100M Ethernet Ports
- WAN/LAN Equipment
- Desktops, Servers and Notebooks
- Cellular Phones
ESD Arrays Mechanical Characteristics:
- MSOP-8 package
- Flammability Rating: UL 94V-0
- Marking: Part number
- Quantity Per Reel:3,000 pcs
- Reel size: 13 inch
ESD Arrays Functional Diagram:
ESD Arrays Absolute Maximum Ratings (TA=25℃ unless otherwise specified):
| Symbol | Parameter | Value | Units |
| VESD |
ESD per IEC 61000-4-2(Air) ESD per IEC 61000-4-2 (Contact) |
±30 ±30 |
KV |
| TOPT | Operating Temperature | -55to+125 | ℃ |
| TSTG | Storage Temperature | -55to+150 | ℃ |
| TLST | Lead Soldering Temperature | 260(10sec.) | ℃ |
I-V Curve Characteristics:
| Symbol | Parameter |
| VRWM | Nominal Reverse Working Voltage |
| IR | Reverse Leakage Current @ VRWM |
| Vt1 | Trigger Voltage |
| It1 | Trigger Current @ Vt1 |
| Vh | Holding Voltage |
| Ih | Holding Current @ Vh |
| VC | Clamping Voltage @ IPP |
| IPP | Maximum Peak Pulse Current |
| VBR | Breakdown Voltage @ IT |
| CJ | Parasitic Capacitance |
Electrical Characteristics (TA = 25℃ unless otherwise specified):
| Symbol | Test Condition | Minimum | Typical | Maximum | Unit |
| VRWM | -- | -- | -- | 2.8 | V |
| IR | VRWM=2.8V, T=25℃ | -- | 0.1 | 1.0 | μA |
| Vt1 | It1=100μA | 3.0 | 3.7 | 4.5 | V |
| Vh | Ih=10mA | 3.0 | -- | 4.0 | V |
| VC |
IPP=2A, tp=8/20μs (Each Line) |
-- | -- | 5.0 | V |
| VC |
IPP=10A, tp=8/20μs (Each Line) |
-- | -- | 8.0 | V |
| VC |
IPP=24A, tp=8/20μs (Each Line) |
-- | -- | 14.0 | V |
| CJ |
VR=3.0V, f=1MHz (Each Line) |
-- | 1.5 | 2.5 | pF |
ESD Arrays Characteristic Curves:
Fig1. 8/20μs Pulse Waveform Fig2. Clamping Voltage VC vs. Current IPP
Fig3. ESD Clamping of I/O to GND
(+8kV Contact per IEC 61000-4-2) Fig4. Normalized Capacitance vs. Voltage
MSOP-8 Package Outline & Dimensions:
| Symbol | Millimeters | Inches | ||
| Minimum | Maximum | Minimum | Maximum | |
| A | 4.800 | 5.000 | 0.189 | 0.196 |
| B | 3.800 | 4.000 | 0.150 | 0.157 |
| C | 1.350 | 1.750 | 0.054 | 0.068 |
| D | 0.350 | 0.490 | 0.014 | 0.019 |
| F | 0.400 | 1.250 | 0.016 | 0.049 |
| G | 1.27 BSC. | 0.05 BSC. | ||
| J | 0.180 | 0.250 | 0.007 | 0.009 |
| K | 0.100 | 0.250 | 0.004 | 0.008 |
| P | 5.800 | 6.200 | 0.229 | 0.244 |
| R | 0.250 | 0.500 | 0.010 | 0.019 |
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