Fibocom L850-GL

1. Core Specifications

• Chipset Platform: Intel XMM 7360
• Network Bands:
  • LTE-FDD: B1/2/3/4/5/7/8/11/12/13/17/18/19/20/21/26/28/29/30/66
  • LTE-TDD: B38/39/40/41
  • WCDMA (3G): B1/2/4/5/8
   
• Speed:
  • Downlink (DL): Up to 450 Mbps (Cat.9, 3-carrier aggregation)
  • Uplink (UL): Up to 50 Mbps
   
• Interface: M.2 2230 or 3042 (M.2 B key)
• Dimensions: 42.0 × 30.0 × 2.3 mm
• Power Supply: 3.1V ~ 4.4V
• Operating Temperature: -10°C ~ +55°C
• GNSS: Supports GPS, GLONASS, BeiDou
• Features: Supports eSIM, 2×2 MIMO, 3CA/2CA carrier aggregation

2. Main Applications & Certifications

• Typical Devices:
• commercial laptops / tablets, industrial gateways, IoT devices
•  
• Certifications:
  • Global certifications: GCF, CE, FCC, IC, and more than 35 others
  • Carrier certifications: Verizon, AT&T, Vodafone, SoftBank, and more than 10 other operators
   

3. Common Applications

1. Laptop 4G Internet Access: Install into a computer with an M.2 WWAN slot; mobile internet is available with a SIM card.
2. Industrial/Vehicular Use: 4G data transmission for industrial tablets, gateways, and outdoor equipment.
3. Global Roaming: Full band coverage, suitable for international business and travel.

4. Comparison with Similar Models

• L850-GL: Cat.9, 450 Mbps, Intel 7360, global full-band version
• L860-GL: Cat.10, 5CA, higher downlink speed (approx. 600 Mbps)
• FM350-GL: 5G module (not 4G)