AC100 Series High Speed Die Bonder Mobile Communication QFN MEMS SIP OTHER Automotive industry Aiot Filp Chip Inspection

AS200 Series High Speed Die Bonder

The AS200 series high- speed dispensing and bonding machine can be applied in the advanced MEMS bonding process to achieve die bonding of high-density and high-reliability, and supports versatile packages, such as QFN, SIP, LGA , BGA and FC , for a variety of different application

scenarios . Various advanced technologies and innovative processes are used in the design and production of the AS200 to ensure its high speed, high accuracy and versatility.

The AS200's modular whole-set design allows for rapid inline production and supports " Direct Attach-Flip Chip" function switching, making production more flexible and efficient.

In addition, the AS200 can be optionally designed to meet the DAF film heating process through its forward-looking track design , and achieve stable , high-speed and high-precision production through the optimized design of the dispensing and pick & place mechanisms and the reconfiguration of the motion logic.

The technical specifications and performance of AS200 meet international standards , making it a high performance , highly reliable and internationally competitive dispensing and die attaching machine, enabling customers to have minimal cost and maximum ROI.

Features and Advantages

• High-speed / high-precision die bonding process

Nearest handling path planning as per enabled modules.
Automatic calibration and bonding force monitoring with editable cycles.
Active vibration suppression system with <5um amplitude in the die bonding area at full speed.
Lightweight and rigid high-speed die bonding module with a max. speed of 15m/s.

• Expandability and configurability

Dust-proof jacket selectable.
Loading methods compatible for multiple forms of substrate/frame.
Substrate heating by changing tooling supportive.
Thin chip picking process by changing configuration supportive.
Capable of switchingand  between Face-up bonding and Flip-chip bonding by adding and replacing configurations.

• Stable glue control process

Visual inspection automatic adjustment of glue volume.
Optimal high speed and low vibration glue dispensing path planning.
Self-developed high precision dispensing controller of international standard.
Innovative lightweight decoupling dispensing mechanism with a max. accelerated velocity of 2.5g.

• Advanced technology and innovative process

Core functions and technical parameters are on par with international competitors.
Core modules are self-developed to ensure subsequent expansion and upgrading.
Module-based agile architecture design to build advanced software matrix capability.
Capable of handling 12-inch wafers, comparable to competing 8-inch die bonder in terms of footprint.

• Sensor Housing Mounting
• Holder Mounting
• Reinforcement Plate Mountin
• Main Camera And Auxiliary Camera Mounting
• VCM Mounting

Technical Specifications