Shenzhen hongyi electronics Co.,LTD
                                                                                                           
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China BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM for sale
China BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM for sale
China BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM for sale
China BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM for sale
China BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM for sale
China BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM for sale

BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM

Price Negotiable
Price: $50
MOQ: 1
Delivery Time: 3-5 work days
Product Description

Product Introduction

A. Product use: Programming and testing stands, aging and testing of BGA96 IC chips

B. Applicable packaging: BGA96 pin spacing 0.8mm

C. Test seat: BGA96-0.8

D. Features: Adopting C-shaped needles for more stable contact and long service life

E. Working temperature: -55 ℃~150 ℃ Current: 1A max

F. Our company can provide specifications (layout drawings), PDF files  CAD

Specifications and dimensions

A. Model: BG96-0.8

B. Pin spacing (mm): 0.8

C. Foot position: 96

D. Chip size: 13 * 7.5mm


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