QFN IC SOCKET
Qfn24 Test Stand Aging Stand Programming Stand Burning Fixture Socket Spacing 0.5mm Chip Size 4 × 4mm Bullet Gold Platin
Feature :* 100% brand new , high Quality and duarable* Technical support and datasheet are available if you need .* we are the original manufacturer and welcome anyone to be our distribution agents* Professional manufacturer in all kinds of IC chip testing sockets and adapters.Product Feature :1. Use double contact technology , contact more stable .2. The socket shell use special engineering plastic , high strength , long mechanical life .3. The shapnel use import beryllium
Qfn/dfn8 Ic Socket Burner Adapter Aging Seat 0.5mm Spacing Chip Size 2 × 3mm
Feature :* 100% brand new , high Quality and duarable* Technical support and datasheet are available if you need .* we are the original manufacturer and welcome anyone to be our distribution agents* Professional manufacturer in all kinds of IC chip testing sockets and adapter
QFN44 Burn-in Socket Pin Pitch 0.5mm IC Body Size 7x7mm IC550-0444-010-G Clamshell Flash Test Socket Adapter
QFN44 MLF44 WLCSP44 Burn in Socket Pin Pitch 0.5mm IC Body Size 7x7mm IC550-0444-010-G Clamshell Flash Test Socket Adapter Product Features:a.Clamshell structure burn in socketb.Adopting engineering material for socket structure,Strength is high ,lifetime is longc.Adopting import BeCu material for socket contactSpring ,thickening gold-plating surface ,impedance is small elasticity is goodd.For 0.4mm pitch packagee.Thru hole design Material & Performance:Ø socket Body: PEIØ
QFN32 MLF32 programm IC Test Socket IC549-0324-006-G Pitch 0.4mm Clamshell Chip Size 4*4 Flash Adapter Programming Socke
QFN32 MLF32 programm IC Test Socket IC549-0324-006-G Pitch 0.4mm Clamshell Chip Size 4*4 Flash Adapter Programming SocketProduct Features:a.Clamshell structure burn in socket b.Adopting engineering material for socket structure,Strength is high ,lifetime is longc.Adopting import BeCu material for socket contactSpring ,thickening gold-plating surface ,impedance is small elasticity is goodd.For 0.4mm pitch packagee.Thru hole design Material & Performance:Ø socket Body: PEIØ
QFN64 socket IC Test Socket IC550-0644-006-G Pitch 0.5mm Chip Size 9*9 Flash Adapter Clamshell MLF64Applicable packagi
Applicable packaging: QFN64Pin spacing: 0.5mmTest seat: QFN64-0.5Chip size: 9 * 9mm
QFN52 Burn in Socket MLF52 IC Test Socket Pitch 0.4mm Alloy Clamshell Chip Size 6*6 Flash Adapter Programming Socket
QFN52 Burn in Socket QFN52 MLF52 IC Test Socket Pitch 0.4mm Alloy Clamshell Chip Size 6*6 Flash Adapter Programming Socket Product Features:a.Clamshell structure burn in socketb.Adopting engineering material for socket structure,Strength is high ,lifetime is longc.Adopting import BeCu material for socket contactSpring ,thickening gold-plating surface ,impedance is small elasticity is goodd.For 0.4mm pitch packagee.Thru hole design Material & Performance:Ø socket Body: PEIØ
QFN32 Data Recovery Burning Adapter High-Temperature Aging Resistant Seat 0.35/0.4/0.5Mm Spacing Ic Socekt
Product IntroductionA. Product Usage: Lead out chip pins for easy aging testing, programming, and data recovery of chips.B. Features: U-shaped structure, more stable contact, and long service life. Mechanical life: 30000-50000 cyclesC. Working temperature: -55 ℃~155 ℃ Current: maximum 1AD. We are a factory that can provide test seat drawings (PDF)Specifications and dimensionsA. Model: QFN-32-0.4/0.5B. Pin spacing (mm): 0.4/0.5MMC. Number of PINs: 32D. Chip size: 4 * 4mm/5*5mm