Aging Seat Sop14 (20) -1.27 Lower Pressure Bullet Seat Ots14 Test Seat Semiconductor Components

1.Specification and Dimension :

* Type : Test & Programming Socket ( with pcb )

* Test & Burn in SockAet ( without pcb )

* Package :SOP14

* Pinpitch :1.27 mm

* Chip size:5.0 mm

* Max Current Capacity  : 1A/pin

* Mechanical life : 10000Times

* Temperature: -45~+125

*Contact resistance : 100mΩ MAX.

* Insulation resistance : 1000m Min,At DC 500V

* Voltage resistance : 700V AC at 1 min

* PIN feet stretch : 55g/PIN(Normal)

2. Material :

*Insulation shell material: PEI, PPS

*Bow shaped metal shrapnel/POGOPIN: beryllium copper (Be Cu) Gold plating over Nickel plating

Product advantages:

1. Use double contact technology ,  contact more stable .

2. The socket shell use special engineering plastic ,  high strength , long mechanical life .

3. The shapnel use import beryllium copper ,  small impedance , good flexibility .

4. Coating with ticken gold plating layer ,  contact ticken electroplate , lowest contact resistance , high reliability .

We are the original factory and have our own factory and engineers. If you cannot find the test stand you need, please contact us and we can provide customized services. If you want to purchase in bulk, you can contact us and we can offer more favorable discounts!

*Usage scenario QFN/QFP/BGA/SOP/TSOP/TSSOP/SSOP/LGA/DFN/EMMC/EMCP/SSD/SOT/DDR/WSON/TF/TO/MCU/adapter/programmerHumid heat/yclic tests/Temperature cycling tests/Programmer Adapter Socket/Test Conversion Burner/Programming test stand/PurposeChip/programmateur adaptateur prise/IC Sockets/IC Connector/Adaptateur de programmeur//OVEN box/flash/BURN-IN/detection/Aging test/Chip programming socket/Chip data recovery test stand/Chip adapter/Burn-in socket/Burning socket/ Socket/IC Connector/prise pour/test benchAdaptateur de prises ICadapter/programmer/BURN-IN/flash/programming/Humid heat, cyclic tests/Temperature cycling tests/IC Test/IC/Chip/Socket Converter Module