High-Performance Ceramic Substrate for Electronics - 200°C+ Heat Resistance & Superior Thermal Conductivity
Price:
1-30USD
MOQ:
1
Delivery Time:
5-10 work days
Brand:
Jingnawei
Product Description
Applications & Industries
Ceramic substrates are engineered for demanding electronic applications across multiple high-performance sectors:
- High-power semiconductor modules and intelligent power modules
- Semiconductor coolers and electronic heaters
- Power control circuits and power mixing circuits
- High-frequency switching power supplies and solid state relays
- Automotive electronics and aerospace/military components
- Solar panel components and telecommunications systems
- Laser systems and industrial electronics
Technical Performance Features
| Feature | Performance Benefit |
|---|---|
| High Thermal Conductivity | Efficiently dissipates heat from high-power devices |
| Excellent Heat Resistance | Withstands operating temperatures exceeding 200°C |
| Matched CTE | Compatible thermal expansion coefficient reduces thermal stress |
| Low Dielectric Constant | Enhanced high-frequency performance and signal transmission |
| High Mechanical Strength | Durable construction for packaging and application requirements |
| Superior Corrosion Resistance | Resists strong acids, alkalis, boiling water, and organic solutions |
| Compact Structure | Enables airtight packaging for sensitive electronic devices |
Performance Specifications
- Thermal conductivity optimized for high-power heat dissipation
- Operating temperature range: >200°C continuous operation
- Thermal expansion coefficient matched to semiconductor materials
- Low dielectric constant for high-frequency applications
- Robust mechanical properties for demanding environments
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Company
HENAN JINGNAWEI TECHNOLOGY CO., LTD