Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine
Price:
Negotiable
MOQ:
≥1 pc
Delivery Time:
25~50 days
Brand:
Suneast
Product Description
Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine
Product Overview
The CBD2200 IC Bonder is a high-precision machine designed for small batch placement operations. It features automatic bonding head switching capability for handling chips with varying parameters.
Key Specifications
Model
CBD2200
Machine Dimensions
1610(L)×1380(W)×1620(H)mm
Placement Accuracy
±10um@3σ
Die Size Range
0.25×0.25mm to 10×10mm
Substrate Size
L300×W100
Placement Pressure
30-500g
Advanced Features
- Supermini chip placement capability
- Ultrathin die bonding technology
- Automatic nozzle change system
- Bottom photo-taking for high precision placement
- Quick changeover between operations
Technical Specifications
| Parameter | Specification |
|---|---|
| Placement Accuracy | ±10um@3σ |
| Placement Angle Accuracy | ±0.3°@3σ |
| Loading Mode | Wafer box |
| Placement Head | 0-360° rotation/Auto change nozzle (option) |
| Core Motion Module | Linear motor + grating scale |
| Platform Base | Marble platform |
Primary Applications
Ideal for small batch production of military RF products, power modules, and power amplifiers. Capable of automatically switching between various mounting heads to accommodate different chip parameters.
Operation Requirements
- Leakage protection switch: ≥100ma
- Compressed air: 0.4-0.6Mpa (Inlet pipe: Ø10mm)
- Vacuum requirement:
- Power: AC220V, 50/60HZ (Three core power copper wire ≥2.5mm²)
- Ground requirement: Must withstand 800kg/m² pressure
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
Location
Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China
Contact Person
Yang