Product Description
Sintering Die Bonder SDB 200
Product Specifications
| Attribute | Value |
|---|---|
| Model | SDB 200 |
| Machine dimension | 1050(L)*1065(W)*1510(H)mm |
| Equipment net weight | Approx.900kg |
| Placement accuracy | ±10um |
| Placement angle deviation | ±1° |
| Placement head heating temp | Max.200℃ |
| Placement head rotation angle | Max.345° |
| PCB loading method | Manual |
| Core motion module | Linear motor+grating scale |
| Customizable | Yes |
Product Overview
Automatic Compact Structure Sintering Die Bonder SDB200 with wafer loading capability, designed for power semiconductor IC bonding market. Features a powerful BONDHEAD system with high precision bonding, pressure holding circuit maintaining and heating functions for presintering bonding of electric components.
Key Features
- High speed and high accuracy die bonding
- Heating function for placement head and platform
- High accuracy temperature control system
- Precise force control system
- Wafer loading support
- Automatic nozzle change
- Automatic pin base change
- Compact structure with small footprint
Product Advantages
High precision
Placement accuracy: ±10um
Rotation accuracy:±0.15°
Placement accuracy: ±10um
Rotation accuracy:±0.15°
Stable motion
Compact structure with self-developed gravity balance system for stable operation
Compact structure with self-developed gravity balance system for stable operation
Wafer loading
8 inches wafer standard support
8 inches wafer standard support
Nozzle base
Automatic nozzle change with 5 nozzles
Automatic nozzle change with 5 nozzles
Applications
Presintering die bonder suitable for IGBT, SiC, DTS, resistance and other high temperature presintering processes. Mainly used in power module, power supply module, new energy, smart grid and other industrial applications.
Technical Parameters
| Parameter | Specification |
|---|---|
| Placement accuracy(um) | ±10 |
| Rotation accuracy(@3sigma) | ±0.15° |
| Placement angle deviation | ±1° |
| Placement Z axis force control(g) | 50-10000 |
| Force control accuracy(g) | 50-250g, repeatability ±10g; 250g-8000g, repeatability ±10% |
| Placement head heating temp | Max. 200℃ |
| Placement head rotation angle | Max. 345° |
| Placement heat cooling | air/nitrogen cooling |
| Chip size(mm) | 0.2*0.2～20*20 |
| Wafer size(inch) | 8 |
| Placement workbench heating temp | Max. 200℃ |
| Placement workbench heating zone temp deviation | ＜5℃ |
| Placement workbench available size(mm) | 380×110 |
| Max. Placement head XYZ axis stroke(mm) | 300x510x70 |
| Equipment repaceable nozzle number | 5 |
| Equipment replacement Pin module number | 5 |
| PCB loading method | Manual |
| Wafer loading Method | Semi-auto(manually place wafer cassette, automatically take wafer) |
| Core motion module | Linear motor+grating scale |
| Machine platform base | Marble platform |
| Machine main body dimension(L×W×H, mm) | 1050X 1065 X 1510 |
| Equipment net weight | Approx.900kg |
Installation Requirements
1. Leakage protection switch: ≥100ma
2. Compressed air requirement: 0.4-0.6Mpa
Inlet pipe specification: Ø10mm
Inlet pipe specification: Ø10mm
3. Vacuum requirement:Inlet pipe specification: Ø10mm
Tracheal joint: 2 pieces
Tracheal joint: 2 pieces
4. Power requirements:
①Voltage: AC220V, frequency 50/60HZ
②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA
①Voltage: AC220V, frequency 50/60HZ
②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA
5. The ground is required to withstand a pressure of 800kg/m²
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
Location
Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China
Contact Person
Yang