Product Description
IC Bonding Machine
The IC bonder is designed for multi-chip placement applications, featuring a mature technology platform that delivers superior accuracy through an advanced vision system and thermal compensation algorithm. The machine achieves higher operational speeds via an innovative image processing unit and optimized architecture.
Applications
This IC bonding machine is suitable for processing various package types including:
- IC, WLCSP, TSV, SIP
- QFN, LGA, BGA
Ideal for manufacturing components such as:
- Optical communication modules
- Camera modules and LED products
- Power modules and power devices
- Vehicle electronics and 5G RF components
- Memory, MEMS, and various sensors
Machine Gallery
Precision die bonding | Semiconductor manufacturing | Chip placement technology | Automated IC assembly
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Get in Touch
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Company
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
Location
Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China
Contact Person
Yang