New Original 64G 128G 256G BGA153 EMMC 5.1 Flash Memory Integrated Circuits Electronic Components IC Chip
Price:
Negotiable
MOQ:
50pcs
Delivery Time:
10 to 15 days
Brand:
PG
Product Description
BGA153 eMMC 5.1 Flash Memory IC Chips
New Original 64GB, 128GB, and 256GB BGA153 eMMC 5.1 Flash Memory Integrated Circuits - essential electronic components for smart speaker applications and embedded systems.
eMMC (Embedded Multimedia Card) delivers high integration, exceptional stability, reliability, and cost-effective performance, making it a core storage component in smart speaker hardware solutions. These chips handle critical functions including firmware storage, data caching, and operational support.
Technical Specifications
| Model | G2864TLCB/G28128TLCB/G28256TLCB |
|---|---|
| Capacity | 64GB / 128GB / 256GB |
| Working Temp | -25°C to 85°C |
| Wafer | KIOXIA |
| Package Type | BGA153 |
| Read Speed | 330 MB/s |
| Write Speed | 240 MB/s |
Competitive Advantages for Smart Speaker Applications
Customized Capacity Solutions
Multiple capacity options from 64GB to 256GB to meet diverse smart speaker price points and performance requirements.
Optimized Power Efficiency
Advanced controller algorithms minimize standby power consumption, enhancing device stability when integrated with smart speaker power management systems.
Broad Platform Compatibility
Compatible with mainstream chip platforms including MediaTek, Rockchip, Quanzhi, and other common smart speaker processors. Comprehensive driver support accelerates product development cycles.
Core Requirements for Smart Speaker eMMC
- Low Power Adaptation: Supports sleep and power-saving modes to minimize energy consumption during standby, maintaining wake-up functionality while reducing overall power usage.
- Stable Read/Write Performance: Fast sequential read/write speeds ensure quick firmware loading and large file processing. Random read/write capabilities enable rapid voice command parsing and response.
- High Reliability & Durability: Engineered for continuous 24/7 operation, capable of withstanding prolonged high-frequency read/write cycles from logging, updates, and system operations.
- Compact Size & High Integration: BGA packaging integrates flash memory and controllers into a single chip, eliminating additional control circuits and optimizing PCB space for compact smart speaker designs.
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Company
China Chips Star Semiconductor Co., Ltd.
Location
Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
Contact Person
Sunny Wu