PG Brand Automotive Grade eMMC 5.1 for IVI System 64GB 128GB 256GB Embedded IC Chips
Price:
Negotiable
MOQ:
50pcs
Delivery Time:
3 to 5 days
Brand:
PG
Product Description
PG Brand Automotive Grade eMMC 5.1 for IVI System
PG Brand automotive-grade eMMC(from China Chips Star Semiconductor Co., Ltd.) available in 64GB, 128GB, and 256GB capacities, these embedded IC chips provide reliable storage solutions for modern in-vehicle infotainment systems.
Advanced IVI System Solution
As intelligent connected vehicles rapidly evolve, In-Vehicle Infotainment (IVI) systems have transformed from basic audio-visual playback into comprehensive intelligent cockpit modules. These systems now integrate navigation, voice interaction, connectivity, high-definition media, and OTA updates, demanding exceptional reliability, performance, capacity, and environmental adaptability from storage components.
Automotive-Grade Reliability
PG Brand automotive-grade eMMC(from China Chips Star Semiconductor Co., Ltd.) memory chips are engineered specifically for demanding in-vehicle environments through comprehensive reliability design:
- AEC-Q100 automotive reliability certified and IATF16949 quality management system certified
- Wide operating temperature range: -45°C to 105°C
- Superior vibration resistance and electromagnetic interference protection
- Advanced data security with 4K LDPC ECC error correction
- Global wear leveling management and emergency power-off protection
These chips ensure stable operation across extreme conditions, from engine compartment heat to winter cold, while preventing data loss from sudden power interruptions.
Technical Specifications of PG Brand automotive-grade eMMC(from China Chips Star Semiconductor Co., Ltd.)
| Interface | eMMC 5.1 with HS400 support |
|---|---|
| Capacities | 64GB, 128GB, 256GB |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Temperature Range | -45°C to 105°C |
| Endurance | High endurance for frequent read/write cycles |
| Security | RPMB, secure boot, and write protection |
| Package | BGA (Ball Grid Array) |
| Package Size | 11.5 x 13 x 1 mm |
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Company
China Chips Star Semiconductor Co., Ltd.
Location
Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
Contact Person
Sunny Wu