Automotive Grade eMMC 5.1 BGA153 HS400 Memory IC for ADAS 64GB 128GB
Price:
Negotiable
MOQ:
50
Delivery Time:
3 to 5 days
Brand:
PG
Product Description
Automotive Grade eMMC 5.1 BGA153 HS400 Memory IC for ADAS 64GB 128GB
Product Overview
PG Brand Automotive Grade eMMC 5.1 is a high-performance embedded memory solution built exclusively for automotive scenarios. It features outstanding reliability and stable performance to match the strict operating demands of vehicle equipment. With compact package design and excellent scalability, it serves as an ideal storage option for automotive electronic systems.
Key Features
- Blazing Fast Speeds: Supports eMMC 5.1 standard and HS400 mode delivering data transfer speeds up to 400MB/s to boost system efficiency and shorten boot time
- High-Capacity Options: Offered in 64GB and 128GB to satisfy various automotive storage demands
- Enhanced Reliability: Adopts advanced NAND flash technology equipped with wear leveling, bad block management, and error correction mechanisms to guarantee long-term data integrity
- Low Power Consumption: Optimized power design adapts to vehicle power supply systems for stable energy operation
- Compact Design: Combines flash memory and controller into a single BGA package to save PCB layout space
- Wide Temperature Range: Operates stably within -40°C to 105°C, fully compliant with automotive temperature standards
- Advanced Security: Integrated RPMB (Replay Protected Memory Block) enables secure data storage and identity authentication for vehicle devices
Applications
Automotive Infotainment Systems, ADAS, and Vehicle Telematics
Technical Specifications
| Parameter | Details |
|---|---|
| Interface | eMMC 5.1 with HS400 support |
| Available Capacities | 64GB, 128GB |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Endurance | High endurance for frequent read/write cycles |
| Security | RPMB, secure boot, and write protection |
| Operating Temperature | -40°C to 105°C |
| Package Size | 11.5 x 13 x 1 mm |
| Package | BGA 153 (Ball Grid Array) |
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Get in Touch
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Company
China Chips Star Semiconductor Co., Ltd.
Location
Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
Contact Person
Sunny Wu