EMMC5.1 64GB 256GB 128GB Vehicle Terminal EMMC5.1 Withstanding 85℃ High-Temperature Exposure Uninterrupted Data Transmission 512GB EMMC
Price:
Negotiable
MOQ:
50pcs
Delivery Time:
10 to 15 days
Brand:
PG
Product Description
EMMC5.1 64GB 256GB 128GB Vehicle Terminal EMMC5.1
High-performance eMMC 5.1 storage solution designed for vehicle terminals, featuring extended temperature range support and uninterrupted data transmission capabilities in capacities up to 512GB.
Technical Specifications
| Interface | eMMC 5.1 with HS400 support |
|---|---|
| Capacities | 64GB, 128GB, 256GB |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Temperature Range | -40°C to 105°C |
| Endurance | High endurance for frequent read/write cycles |
| Security | RPMB, secure boot, and write protection |
| Package | BGA (Ball Grid Array) |
| Package Size | 11.5 x 13 x 1 mm |
Low Power Consumption and High Reliability
Optimized for embedded device power requirements, eMMC supports multiple power-saving modes including sleep and standby modes. During standby or low-load conditions, it reduces operating voltage and clock frequency to minimize power consumption. Advanced controller functions such as bad block management, ECC error correction, and wear leveling significantly enhance data storage reliability and reduce data loss risks.
Controllable Cost and Mature Mass Production
The integrated design and standardized production of eMMC modules reduce manufacturing costs, while mature NAND flash mass production processes ensure ample capacity and further cost reduction. Compared to high-performance UFS storage, eMMC offers significant cost advantages, making it the preferred storage solution for mid-to-low-end consumer devices and industrial-grade applications.
Simplified Host-Side Development
The eMMC controller handles all underlying storage management tasks including bad block processing, wear leveling, and encryption. Host systems only need to implement data read/write operations through standardized MMC drivers, eliminating the need to manage flash memory details. This packaged design approach significantly simplifies host-side software development and shortens terminal device R&D cycles.
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Company
China Chips Star Semiconductor Co., Ltd.
Location
Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
Contact Person
Sunny Wu