NUW Brand PSLC eMMC 4GB 8GB 16GB Nand Chip Component for Embedded Board RK3568 RK3588
Price:
Negotiable
MOQ:
50pcs
Delivery Time:
10 to 15 days
Brand:
NUW
Product Description
NUW Brand PSLC eMMC 4GB 8GB 16GB Nand Chip Component for Embedded Board RK3568 RK3588
NUW Brand PSLC eMMC is a memory chip specially designed for embedded platforms such as RK3568 and RK3588. It adopts pSLC (Pseudo-SLC) technology, it simulates the SLC single-bit storage mode based on TLC NAND, striking a balance between high reliability, long lifespan and cost-effectiveness. NUW Brand PSLC eMMC is suitable for demanding applications including industrial control, edge computing, automotive electronics and AIoT.
Core Technical Advantages of pSLC eMMC
- pSLC (Pseudo-SLC) Technology
Configures TLC NAND to store only 1 bit per cell, simulating SLC characteristics:
- Greatly improved lifespan: Up to 30,000 P/E cycles, meeting high-frequency write scenarios
- Faster and more stable writing: Reduced charge interference, lower write latency, and more consistent performance
- Enhanced data security: Strong anti-interference and power-off protection, reducing the risk of data errors
- pSLC eMMC Optimized for Rockchip RK3568 / RK3588 Platforms
- Perfect compatibility: Matches the eMMC 5.1 controller of RK3568/RK3588 and supports HS400 high-speed mode
- Boot support: Supports eMMC booting, RPMB secure partitions, and hardware reset
- System compatibility: Compatible with embedded systems including Android, Linux, Debian, Ubuntu, and Buildroot
- Stable coordination: Adapts to the computing power and storage bandwidth requirements of RK3568 (quad-core A55) and RK3588 (octa-core A76+A55)
Technical Specifications of PSLC eMMC 5.1
| Model | G2504GPLCB | G2508PLCB | G2516PLCB |
|---|---|---|---|
| NAND Flash | PSLC | PSLC | PSLC |
| Capacity | 4GB | 8GB | 16GB |
| Warranty | 1 Year | 1 Year | 1 Year |
| Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating Temperature0 | 0℃~70℃ | 0℃~70℃ | 0℃~70℃ |
| EP | ≥30000 | ≥30000 | ≥30000 |
| Packaging Specification | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.2mm |
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Company
China Chips Star Semiconductor Co., Ltd.
Location
Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
Contact Person
Sunny Wu