eMMC 5.1 Wide Temperature Range BGA 153 Package PSLC NAND Flash for Industrial Equipment
Price:
Negotiable
MOQ:
50pcs
Delivery Time:
10 to 15 days
Brand:
PG
Product Description
eMMC5.1 Wide Temperature eMMC 8GB 4GB 16GB BGA Package Long-service Storage Die for Industrial Equipment
Product Overview
eMMC5.1 Wide Temperature eMMC 8GB 4GB 16GB BGA Package Long-service Storage Die for Industrial Equipment
Mature Supply Chain Support
The product relies on mainstream original supply chains including Samsung, n, SK Hynix, and SanDisk, ensuring stable supply and verified quality through long-term market testing. This enables quick response to bulk purchase requirements and reliable product delivery guarantees.
- Higher cost performance compared to UFS storage solutions
- Maintains core performance for daily operational requirements
- Ideal for mid-to-low-end devices and cost-sensitive applications
- Supports 1.8V/3.3V dual-voltage adaptation
- Excellent power consumption control for reduced energy consumption
- Extended battery life for terminal devices
- Balances performance, cost, and energy consumption requirements
Technical Specifications - PSLC eMMC 5.1
| Model | G2504GPLCB | G2508GPLCB | G2516GPLCB |
|---|---|---|---|
| NAND Flash | PSLC | PSLC | PSLC |
| Capacity | 4GB | 8GB | 16GB |
| Warranty | 1 Year | 1 Year | 1 Year |
| Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating Temperature | 0℃~70℃ | 0℃~70℃ | 0℃~70℃ |
| EP | ≥10000 | ≥10000 | ≥10000 |
| Packaging Specification | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mm*13mm*1.0mm | 11.5mm*13mm*1.0mm | 11.5mm*13mm*1.0mm |
Production Line
Product Exhibition
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Get in Touch
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Company
China Chips Star Semiconductor Co., Ltd.
Location
Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
Contact Person
Sunny Wu