China Chips Star Semiconductor Co., Ltd.
                                                                                                           
Verified Supplier
7 Years
Since 2019
Menu

AEC-Q100 Certified Automotive eMMC Chip with 330MB/s Read Speed and Wide Temperature Resistance for TCU

Price Negotiable
Price: Negotiable
MOQ: 50pcs
Delivery Time: 3 to 15 days
Brand: PG
Product Description
AEC-Q100 eMMC for Automotive Telematics Control Unit TCU Storage Solution eMMC Chip

Automotive EMMC For T-Box EMMC 64GB 128GB BGA153 For Vehicle Telematics

China Chips Star PG brand automotive-grade eMMC (e.g. G2864GTLCA) is customized exclusively for automotive control units including TCU and T-BOX. Telematics Control Unit (TCU), the hub of vehicle telematics for smart vehicles, undertakes five core functions: vehicle data collection, remote monitoring, OTA updates, V2X communication and fault log storage. Its storage device must withstand harsh automotive operating environments and deliver superior stability.

Key Performance Features of Automotive eMMC Chip
  • Wide temperature resistance: -40℃~105℃ (adaptable to extreme conditions in engine bays and outdoor environments)
  • Excellent shock & interference resistance: Stable data performance against vehicle vibration and voltage fluctuation
  • Low power consumption & long service life: Standby current ≤100μA, MTBF ≥ 30 million hours
  • AEC-Q100 certification: Mandatory reliability standard for automotive electronic products, fully compatible with automotive electronic architecture
Consumer-grade eMMC (operating temperature: 0℃~70℃) cannot work under extreme high/low temperature and vibration. While UFS features higher performance, it comes with higher costs and complicated integration. Therefore, automotive-grade eMMC is the most cost-effective storage solution for TCU.
Core Advantages of China Chips Star Automotive-grade eMMC
1. Professional Automotive-grade Certification

The full product line is certified to AEC-Q100, supporting operating temperature from -40℃ to 105℃. Equipped with LDPC hardware ECC & power failure protection, preventing system damage caused by interrupted OTA upgrades or data writing.

2. Customized Design for TCU

Compact package: 153-ball BGA form factor, suitable for compact PCB layout of TCU modules. Ultra-low power consumption: Auto sleep mode designed for vehicle battery energy-saving scenarios.

Factory Images

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company China Chips Star Semiconductor Co., Ltd.
Location Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
Contact Person Sunny Wu

Request A Quote

Please check your email address.
Your message must be at least 20 characters.