China Chips Star Semiconductor Co., Ltd.
                                                                                                           
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Wide Temperature Industrial eMMC5.1 Grade EMMC5.1 High Quality Good Die 64GB 128GB 256GB ICs for Laptop & Smartphone Excellent for Mobile Devices

Price Negotiable
Price: Negotiable
MOQ: 50
Delivery Time: 3 to 5 days
Brand: PG
Product Description

                     

                                             


                                             Product Description

Industrial Grade EMMC5.1 High Quality Good Die 64GB 128GB  ICs for Laptop & Smartphone Excellent for Mobile Devices 



  • 1. Product Overview

    This is an automotive grade eMMC 5.1 memory IC designed for high reliability and stable performance in vehicle electronic systems. Built with BGA153 package, it supports HS400 high-speed interface to meet the strict requirements of ADAS infotainment and telematics applications.

    2. Core Specifications

    • Memory Type: eMMC 5.1
    • Capacity Options: 64GB 128GB 256GB
    • Package: BGA153
    • Clock Speed: Up to 200MHz (HS400)
    • Power Supply: 3.3V / 1.8V
    • Bus Width: 1bit / 4bit / 8bit

    3. Key Features

    • High-speed data transfer up to 400MB/s via HS400 interface
    • Wide operating temperature range for automotive environments
    • Compact BGA153 package saves PCB layout space
    • Optimized power consumption for vehicle power systems
    • Built-in reliability mechanisms for long-term stable operation

    4. Main Applications

    • Automotive ADAS systems
    • Vehicle infotainment units
    • Telematics and on-board communication devices

    5. Shipping & Payment

    • Shipping Methods: DHL UPS Fedex EMS HK Post
    • Payment Terms: Paypal TT Western Union Trade Assurance
                              Technical Specifications
Parameter Details
Interface eMMC 5.1 with HS400 support
Available Capacities 64GB, 128GB
Data Transfer Speed Up to 400MB/s (HS400 mode)
Operating Voltage 3.3V (VCC), 1.8V/3.3V (VCCQ)
Endurance High endurance for frequent read/write cycles

Security

RPMB, secure boot, and write protection
Operating Temperature

-40°C to 105°C

Package Size

11.5 x 13 x 1 mm

Package

BGA 153 (Ball Grid Array)

Pictures of China Chips Star Semiconductor Co., Ltd

Why Choose Our Wide-Temp Automotive Grade eMMC 5.1?
  • Cost-Effective: Integrated NAND flash and controller reduces BOM costs
  • Extreme Environment Resilience: Wide temperature support ensures stable operation from -45°C to 105°C in harsh automotive conditions
  • Easy Integration: Standardized interface simplifies design and development for automotive systems
  • Future-Proof: Supports the latest eMMC standards for next-generation vehicle electronics compatibility
Support and Resources
  • Datasheets: Detailed technical specifications including wide-temperature performance data
  • Design Guides: Integration guidelines and best practices for extreme environment applications
  • Technical Support: Expert assistance for your design and validation requirements
Contact Us

Ready to integrate our wide-temperature automotive-grade eMMC 5.1 into your next project? Contact our sales team for pricing, samples, and custom solutions.




Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company China Chips Star Semiconductor Co., Ltd.
Location Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
Contact Person Sunny Wu

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