Good Reliability at High Temperatures Ultra Fine wire 0.01 mm Cu Bonding Wire for electronics package
Price:
999
MOQ:
1PC
Delivery Time:
5-8 WORKING DAYS
Brand:
WINNER
Product Description
Good Reliability at High Temperatures Ultra Fine wire 0.01 mm Cu Bonding Wire for electronics package
Copper bonding wires have grown in popularity as a means of making interconnects in an elecronics package, thanks to it's lower costs than materials such as gold, as well as high levels of electrical and thermal conductivity, and good reliability at high temperatures. In many applications, copper wire bonding can provide better performance and reliability than gold wire bonding. Winner can provide Copper bonding wire with different wire diameters from 10um-40um according to customer requirements.Winner can provide Copper bonding wire with different wire diameters from 10um-40um according to customer requirements.
| Characteristics |
| * High conductivity * High tensile strength with high elongation * Good loop stability * Significantly reduced formation of intermetallic phases * Very good ball formation under protective gas |
Applications include:
* Computer : PC, Tablets, Servers & systems, Consumer
* Computer : PC, Tablets, Servers & systems, Consumer
* Electronics : Smartphones & phones, TVs, Imaging devices, Wearable electronics
* Automotive : Body, Safety, Infotainment, Chassis, Powertrain, Security
* Communications : Wireless, Wired, Satellite, NFC
* Energy : Generation, Transmission & distribution, Storage
* Automotive : Body, Safety, Infotainment, Chassis, Powertrain, Security
* Communications : Wireless, Wired, Satellite, NFC
* Energy : Generation, Transmission & distribution, Storage
| Dia | EL(%) | BL(gf) | |||||||
| mil | um | 4N | 5N | 4N | 5N | ||||
| WCBW-1 | WCBW-2 | WCBW-3 | WCBW-4 | WCBW-5 | WCBW-6 | WCBW-7 | WCBW-8 | ||
| 0.6 | 15 | 3-15 | 3-15 | 3-16 | 3-17 | >3.0 | >3.0 | >3.0 | >3.0 |
| 0.7 | 18 | 3-17 | 3-17 | 3-18 | 4-19 | >3.0 | >3.0 | >3.5 | >4.0 |
| 0.8 | 20 | 4-18 | 4-18 | 4-19 | 5-20 | >4.0 | >4.5 | >5.0 | >5.0 |
| 0.9 | 23 | 6-20 | 6-20 | 6-21 | 6-22 | >5.0 | >6.0 | >6.0 | >6.5 |
| 1.0 | 25 | 8-22 | 8-23 | 8-24 | 8-24 | >6.0 | >7.0 | >7.0 | >8.0 |
| 1.2 | 30 | 9-23 | 9-24 | 9-25 | 9-26 | >8.0 | >8.5 | >8.0 | >10.0 |
| 1.3 | 33 | 9-24 | 10-25 | 10-26 | 10-27 | >10.0 | >11.0 | >10.0 | >12.0 |
| 1.5 | 38 | 10-25 | 10-26 | 10-27 | 11-28 | >12.0 | >12.0 | >12.0 | >14.0 |
| 1.7 | 43 | 10-26 | 11-28 | 10-30 | 11-30 | >15.0 | >16.0 | >15.0 | >18.0 |
| 2.0 | 50 | 12-28 | 12-30 | 12-32 | 12-34 | >20.0 | >20.0 | >20.0 | >20.0 |
The Advantages of Copper Bonding Wire Cost Savings
The relatively low cost of copper is one of the reasons for its appeal as an alternative interconnect material. By replacing gold wires with copper material, thus replacing the precious metal part, significant cost savings are possible. In applications that require increased wire diameters, the usage of copper bears a disproportionately high impact on the saving effect. Superior Performance of Copper Wires Copper exhibits significantly better conductivity than gold or aluminum. Therefore better heat dissipation and increased power ratings are attainable with thinner wire diameters. Copper possesses higher mechanical properties compared to gold. Therefore it displays excellent ball neck strength and high loop stability during molding or encapsulation.
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Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang





