Ultra Fine Pd Coated Copper Wire With Bright Blue Coating High Strength 0.01mm Silver Core Bonding Wire For Semiconductor And 5G Device Assembly
Price:
999
MOQ:
1PC
Delivery Time:
5-8 WORKING DAYS
Brand:
WINNER
Product Description
Ultra Fine Palladium Plated Copper Wire with Bright Blue Coating High Strength 0.01mm Silver Core Bonding Wire for Semiconductor and 5G Device Assembly
Designed for high-density semiconductor and 5G millimeter-wave applications, this ultra-fine 0.01mm palladium-plated copper wire features a dual-layer silver core and proprietary bright blue polymer coating to address signal integrity and oxidation challenges in next-gen electronics. The silver core delivers ultra-low resistivity (≤1.5 μΩ·cm) for high-frequency 5G antenna modules, while the 0.1μm palladium coating prevents sulfidation in humid environments, extending lifespan by 50% vs. standard copper wires.
Optimized for automated thermosonic bonding, its ≥4,200 MPa tensile strength and anti-sagging design enable flawless 30μm pitch interconnects in 3D IC stacking and RF front-end packaging. The bright blue coating acts as a visual QC marker for defect detection during high-speed assembly, reducing rework rates by 25%.
ROHS-compliant and JEDEC-QPL listed, it replaces gold wires in 5G base stations and AIoT devices, cutting material costs by 60% while achieving <0.5dB signal loss at 28GHz. Trusted by global OSATs, this wire is the backbone of miniaturized, high-reliability connectivity for 5G smartphones, GaN power amplifiers, and edge-computing chips.
Palladium-Coated Copper (PCC) bonding wire was developed and has now become the most dominant bonding material used in fine wires of diameters of <50 microns being used as substitute for more expensive gold. Thermosonic wire bonding is the most popular form of interconnection for most semiconductors. It requires the creation of a molten Free-Air Ball (FAB) at the end of the wire that is then ultrasonically-pressed on semiconductor bonding pads to form the first bond
| Features: |
|
* Gold-plated/palladium bonding wire made of 4N high-purity copper material with a certain proportion of trace elements added;
* In addition to the characteristics of conventional copper wire, it also has high strength,low curvature, high toughness, and anti-oxidation
* Chemical characteristics, the arc isimpact-resistant and the welding wire is corrosion-resistant;
* Surface gold/palladium special bonding wire developed for IC packaging;
|
What Is Palladium Coated Copper Bonding Wire?
Palladium Coated Copper Bonding Wire is easier to bond than your standard bare copper wire. The Palladium (Pd) coating allows for high performance and stable bonding, all within a wider bonding. The Pd coating controls the oxidation build up that can occur on the surface of the copper wire.
|
Pd Coated Copper Wire |
||||
|
Type |
Ø Diameter ±1% μm |
Breaking Load BL(gf) |
Elongation EL(%) |
Length Meters |
|
PW-1 |
18(0.7mil) |
>4 |
8-14 |
500/1000/2000 |
|
20(0.8mil) |
>5 |
9-15 |
500/1000/2000 |
|
|
23(0.9mil) |
>7 |
10-17 |
500/1000/2000 |
|
|
25(1.0mil) |
>9 |
11-17 |
500/1000/2000 |
|
|
30(1.2mil) |
>14 |
14-22 |
500/1000/2000 |
|
Note: The above Diameter parameters can be customized according to customer requirements.
Application:
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang