High Purity Ultra Fine Gold Bonding Wire of 0.01mm Diameter for Microscale Electronics
Price:
999
MOQ:
1PC
Delivery Time:
5-8 WORKING DAYS
Brand:
WINNER
Product Description
High Purity 0.01mm Gold Bonding Wire for Microscale Electronics
Our ultra-fine gold bonding wire (0.01mm diameter) delivers 99.99% purity, ideal for precision microscale electronics, semiconductor packaging, and advanced MEMS devices. Engineered for high conductivity, low resistance, and superior bond strength, this wire ensures reliable interconnections in high-frequency circuits, LEDs, and medical microcomponents.
Key Features:
* 0.01mm Ultra-Thin Diameter – Perfect for miniaturized electronic assemblies.
* 99.99% Pure Gold – Minimizes oxidation and ensures stable signal transmission.
* Exceptional Ductility – Reduces breakage during thermosonic or wedge bonding.
* ISO-Certified – Complies with RoHS and JIS Z 3284 standards.
Applications:
* Semiconductor die bonding
* Chip-on-board (COB) technology
* Hybrid circuit interconnects
Physical Properties
|
Density:
|
19.34 g/cm3
|
|
Melting Point:
|
1063°C
|
|
Electrical Resistivity: (@20°C)
|
2.3 μΩ-cm
|
|
Electrical Conductivity: (@20°C)
|
75% (IACS)
|
|
Thermal Conductivity: (@20°C)
|
315 W/(m-K)
|
|
Fusing Current (10 mm x 25 μm)
|
0.52 A
|
We take pride in offering a complete range of wire diameters, thereby fulfilling the diverse needs for strength and elongation in different wire applications. Moreover, we collaborate closely with our customers to provide customized solutions. In these custom solutions, technical parameters such as tensile strength and elongation are meticulously tailored to meet their specific requirements. This customer-centric approach enables us to not only meet but exceed the expectations of our clients in the highly competitive market of wire manufacturing and bonding applications.
|
Composition
|
Diameter
|
Tensile Strength (gms)
|
Elongation (%)
|
|
|
99.99% Au
|
0.7 mil
|
17.5 μm
|
3 - 10
|
2 - 6
|
|
0.8 mil
|
20 μm
|
4 - 13
|
2 - 7
|
|
|
0.9 mil
|
22.5 μm
|
5 - 16
|
2 - 8
|
|
|
1.0 mil
|
25 μm
|
6 - 20
|
2 - 8
|
|
|
1.3 mil
|
32.5 μm
|
10 - 45
|
2 - 10
|
|
|
1.5 mil
|
37.5 μm
|
13 - 50
|
2 - 12
|
|
|
1.7 mil
|
42.5 μm
|
15 - 60
|
2 - 12
|
|
|
1.8 mil
|
45 μm
|
20 - 70
|
2 - 12
|
|
|
2.0 mil
|
50 μm
|
25 - 85
|
2 - 15
|
|
|
3.0 mil
|
75 μm
|
50 - 180
|
2 - 20
|
|
Why Gold Bonding Wire?
Gold (Au) bonding wire is used in a wide range of applications rangining from high pin-count, ultra-fine pitch microelectronic devices to high-power discrete components. Au is the preferred choice of bonding material when a) the contact material is not compatible with Aluminum (Al) and/or Copper (Cu) b) the contact area is limited c) the device will be subject to high temperature or high humidity environments.
The Advantages of Gold Bonding Wire:
• Extreme bond reliability
• A wide processing window
• Low-impact ball and wedge bonding
• Superior looping performance
• High tensile test performance
• Excellent corrosion resistance
• Higher fusing current than standard Al bond wire.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang




