Advanced Silver Alloy Bonding Wire for Stable Electrical Connections and Heat Management in Different Industries
Advanced Silver Alloy Bonding Wire for Stable Electrical Connections and Heat Management in Different Industries
Our silver alloy bonding wire is engineered to deliver stable electrical connections and superior heat dissipation across industries like semiconductors, automotive electronics, and power modules. With optimized thermal conductivity and oxidation resistance, it ensures long-term reliability in harsh environments.
Key Advantages:
* Enhanced Electrical Stability – Low resistance for consistent signal transmission.
* Efficient Heat Management – Reduces thermal stress in high-power applications.
* Corrosion-Resistant Alloy – Prolongs lifespan in humid or high-temperature conditions.
* Industry-Compliant – Meets MIL-STD-883 and JEDEC standards.
Applications:
* Power semiconductor packaging
* EV battery interconnects
* Aerospace microelectronics
|
Silver alloy Bonding Wire AG99% |
||||
|
Type |
Ø Diameter ±1% μm |
Breaking Load BL(gf) |
Elongation EL(%) |
Length Meters |
|
YF-99 |
18(0.7mil) |
>4 |
3-20 |
500/1000 |
|
99B |
20(0.8mil) |
>5 |
3-20 |
500/1000 |
|
SW-21 |
23(0.9mil) |
>7 |
3-20 |
500/1000 |
|
99A |
25(1.0mil) |
>8 |
3-20 |
500/1000 |
|
99A |
30(1.2mil) |
>11 |
3-20 |
500/1000 |
Note: The above Diameter, BL and EL parameters can be customized according to customer requirements.
Application:
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