Made from ultra-high purity gold (2N-4N), the Gold Bonding Wire is a key component in semiconductor assembly, providing excellent electrical conductivity for reliable connections. It is highly durable and resistant to corrosion, making it ideal for use in harsh environments. The wire is available in ultra-fine diameters ranging from 13 μm to 70 μm and in lengths from 100 meters to 500 meters. The ability to customize these specifications ensures flexibility for a wide range of applications, from advanced integrated circuits to microelectronic devices. Known for its exceptional mechanical properties and thermal conductivity, this bonding wire ensures stable, efficient, and long-lasting connections in high-performance devices.