15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications
Ultra Fine Gold Plated Silver Wire is designed for high-performance semiconductor and microelectronic applications. Combining the superior conductivity of silver with a thin gold plating layer, this wire offers excellent bonding performance, oxidation resistance, and long-term reliability.
With diameters ranging from 15 μm to 25 μm, it is widely used as a cost-effective alternative to traditional gold bonding wire in IC packaging, LED assembly, and precision electronics manufacturing.
Our advanced manufacturing process ensures:
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Consistent diameter tolerance
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Smooth surface finish
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Stable bonding behavior
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High tensile strength
This makes it an ideal solution for manufacturers seeking both performance and cost optimization.




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