Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Price:
999
MOQ:
1PC
Delivery Time:
5-8 WORKING DAYS
Brand:
WINNER
Product Description
Ultra Fine Palladium Coated Copper Wire 15um 20um 25um Bonding Wire for Chip Packaging
Product Overview
Ultra fine Pd coated copper bonding wire designed for advanced chip packaging with fine pitch and high-density interconnections.
- Available in 15μm, 20μm, and 25μm diameters
- Palladium coating for enhanced performance
- Ideal for fine pitch applications
- Optimized for high-density interconnections
- Advanced chip packaging solutions
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Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang