Ultra Fine Tungsten Wire High Toughness for Semiconductor Packaging Parts
Price:
999
MOQ:
1KM
Delivery Time:
5-8 WORKING DAYS
Brand:
WINNER
Product Description
- Ultra Fine Tungsten Wire High Toughness for Semiconductor Packaging Parts
High toughness to avoid breakage, stable performance for auxiliary parts of semiconductor packaging production.
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Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang



